Materials / Compare
Brass C260 vs. SLA Resin Tough 2000
Compare Brass C260 vs. SLA Resin Tough 2000 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 345MPasourcenominal, strip/flat, 0.5% extension (not 0.2% offset) | 40.4MPasourcetypical |
| Ultimate tensile strength | 427MPasourcenominal, strip/flat | 40.4MPasourcetypical |
| Flexural strength | not sourced | 67MPasourcetypical |
| Elongation at break | 23%sourcenominal, in 2.0 in., strip/flat | 79%sourcetypical |
| Young's modulus (stiffness) | 110GPasourcetypical, temper-independent | 1.8GPasourcetypical |
| Density | 8,525kg/m³sourcenominal | 1,090kg/m³sourcetypical |
| Strength to weight | 40.5kN·m/kg9% higher | 37.1kN·m/kg |
| Stiffness to weight | 12.9MN·m/kg7.83x higher | 1.65MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-M30 = CuZn30 = C26000, rolled products) | not sourced |
| Shear modulus | 41.2GPa | not sourced |
| Bulk modulus | 115GPa | not sourced |
| Speed of sound | 3,597m/s | 1,285m/s |
| Thermal | ||
| Thermal conductivity | 121W/m·Ksourcetypical, 20 °C | not sourced |
| Thermal expansion | 20µm/m·Ksourcetypical, mean 20-300 °C | 134µm/m·Ksourcemean 0-150 °C |
| 100 mm part over a 50 °C swing | 100µm growth6.71x less | 671µm growth |
| Specific heat | 377J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 37.7mm²/s | not sourced |
| Thermal shock resistance | 12,510W/m | not sourced |
| Melting point | 916–954°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 112°CsourceDMA |
| Max service temperature | not sourced | 57°CsourceHDT 1.8 MPa |
| Values for | C26000 cartridge brass, H02 half hard flat/strip: CDA Electronic Connector Design Guide (mechanical) + CDA alloy page (physical) | Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Brass C260 stronger than SLA Resin Tough 2000?
Brass C260 is stronger: its yield strength is 345 MPa against 40.4 MPa for SLA Resin Tough 2000 (8.54x).
Which is lighter, Brass C260 or SLA Resin Tough 2000?
SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 8,525 kg/m³ for Brass C260.
Which is stiffer, Brass C260 or SLA Resin Tough 2000?
Brass C260 is stiffer: Young's modulus 110 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Brass C260 deflects less under the same load.
Which is lighter for the same job, Brass C260 or SLA Resin Tough 2000?
For the same stiffness or strength: Brass C260 is lighter for a stiff rod or tie (tension), strong rod or tie; SLA Resin Tough 2000 is lighter for a stiff panel or plate, strong beam, strong panel or plate.
| Part that must be | Brass C260 | SLA Resin Tough 2000 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 7.83x heavier |
| Stiff beam (bending) | about equal | about equal |
| Stiff panel or plate | 1.98x heavier | lighter |
| Strong rod or tie | lighter | 9% heavier |
| Strong beam | 1.87x heavier | lighter |
| Strong panel or plate | 2.68x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which expands less with temperature?
Brass C260 expands less: 20 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.