Materials / Compare
Copper C110 vs. SLA Resin Tough 2000
Compare Copper C110 vs. SLA Resin Tough 2000 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | 40.4MPasourcetypical |
| Ultimate tensile strength | 221MPasourcetypical5.47x stronger | 40.4MPasourcetypical |
| Flexural strength | not sourced | 67MPasourcetypical |
| Elongation at break | 55%sourcetypical, 1 in. rod | 79%sourcetypical |
| Young's modulus (stiffness) | 117GPasourcetypical65.1x stiffer | 1.8GPasourcetypical |
| Density | 8,913kg/m³sourcenominal | 1,090kg/m³sourcetypical |
| Strength to weight | 7.74kN·m/kg | 37.1kN·m/kg4.79x higher |
| Stiffness to weight | 13.1MN·m/kg7.96x higher | 1.65MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | not sourced |
| Shear modulus | 43.7GPa | not sourced |
| Bulk modulus | 122GPa | not sourced |
| Speed of sound | 3,626m/s | 1,285m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | not sourced |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 134µm/m·Ksourcemean 0-150 °C |
| 100 mm part over a 50 °C swing | 84.5µm growth7.94x less | 671µm growth |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 114mm²/s | not sourced |
| Thermal shock resistance | 8,992W/m | not sourced |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 112°CsourceDMA |
| Max service temperature | not sourced | 57°CsourceHDT 1.8 MPa |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Copper C110 stronger than SLA Resin Tough 2000?
Copper C110 is stronger: its yield strength is 69 MPa against 40.4 MPa for SLA Resin Tough 2000 (1.71x).
Which is lighter, Copper C110 or SLA Resin Tough 2000?
SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or SLA Resin Tough 2000?
Copper C110 is stiffer: Young's modulus 117 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or SLA Resin Tough 2000?
For the same stiffness or strength: Copper C110 is lighter for a stiff rod or tie (tension); SLA Resin Tough 2000 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | SLA Resin Tough 2000 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 7.96x heavier |
| Stiff beam (bending) | 1% heavier | lighter |
| Stiff panel or plate | 2.03x heavier | lighter |
| Strong rod or tie | 4.79x heavier | lighter |
| Strong beam | 5.72x heavier | lighter |
| Strong panel or plate | 6.26x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which expands less with temperature?
Copper C110 expands less: 16.9 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.