Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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JIS ADC12 (Al-Si-Cu, about A383 / EN AC-46100) high-pressure die-casting alloy, as cast; physical properties from Daiki Aluminium Industry (ADC12 ingot producer) measured values; modulus from S.S.Aluminum (ADC12 ingot producer) standard values.
Copper C12200
C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
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NA Alloys Product DataDaiki Aluminium IndustryAluminum ADC12 · Yield strength: one test result, 0.2% proof stress, as cast, ASTM tensile bar (Daiki)Aluminum ADC12 · Ultimate tensile strength: one test result, as cast, ASTM tensile bar (Daiki)Aluminum ADC12 · Elongation at break: one test result, as cast, ASTM tensile bar (Daiki)
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C12200 Alloy (copper.org)Copper Development Associationarchived copyCopper C12200 · Yield strength: typical, 0.5% extension under load, 0.065 in. tubeCopper C12200 · Ultimate tensile strength: typical, 0.065 in. tubeCopper C12200 · Elongation at break: typical, 0.065 in. tubeCopper C12200 · Young's modulus (stiffness): typicalCopper C12200 · Density: nominalCopper C12200 · Thermal conductivity: typical, 20 °CCopper C12200 · Thermal expansion: typical, mean 20-100 °CCopper C12200 · Specific heat: typical, 20 °CCopper C12200 · Melting point: liquidus
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Die-Casting Alloys (ダイカスト用合金)S.S. AluminumAluminum ADC12 · Young's modulus (stiffness): standard value (S.S.Aluminum)
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DIK365 Product DataDaiki Aluminium IndustryAluminum ADC12 · Density: measured (Daiki)Aluminum ADC12 · Thermal conductivity: measured on specimens cut from a 50 x 100 x 5 mm flat die casting (Daiki)Aluminum ADC12 · Thermal expansion: measured, temperature range not stated (Daiki)Aluminum ADC12 · Specific heat: measured (Daiki)Aluminum ADC12 · Melting point: solidus-liquidus (Daiki)
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Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyCopper C12200 · Poisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum ADC12 stronger than Copper C12200?
Aluminum ADC12 is stronger: its yield strength is 149 MPa against 69 MPa for Copper C12200 (2.16x).
Which is lighter, Aluminum ADC12 or Copper C12200?
Aluminum ADC12 is lighter: 2,680 kg/m³ against 8,941 kg/m³ for Copper C12200.
Which is stiffer, Aluminum ADC12 or Copper C12200?
Copper C12200 is stiffer: Young's modulus 117 GPa against 79.8 GPa for Aluminum ADC12, so the same part in Copper C12200 deflects less under the same load.
Which is lighter for the same job, Aluminum ADC12 or Copper C12200?
For the same stiffness or strength: Aluminum ADC12 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Aluminum ADC12
Copper C12200
Stiff rod or tie (tension)
lighter
2.27x heavier
Stiff beam (bending)
lighter
2.75x heavier
Stiff panel or plate
lighter
2.94x heavier
Strong rod or tie
lighter
7.2x heavier
Strong beam
lighter
5.57x heavier
Strong panel or plate
lighter
4.9x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Aluminum ADC12 or Copper C12200?
Copper C12200 stretches further before it breaks: 45% elongation at break against 2.3% for Aluminum ADC12.
Thermal
Which conducts heat better, Aluminum ADC12 or Copper C12200?
Copper C12200 conducts heat better: 339 W/m·K against 125 W/m·K for Aluminum ADC12.
Which expands less with temperature?
Copper C12200 expands less: 16.9 µm/m·K against 21 µm/m·K for Aluminum ADC12.