Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Copper Development Association, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Copper C12200
C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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C12200 Alloy (copper.org)Copper Development Associationarchived copyCopper C12200 · Yield strength: typical, 0.5% extension under load, 0.065 in. tubeCopper C12200 · Ultimate tensile strength: typical, 0.065 in. tubeCopper C12200 · Elongation at break: typical, 0.065 in. tubeCopper C12200 · Young's modulus (stiffness): typicalCopper C12200 · Density: nominalCopper C12200 · Thermal conductivity: typical, 20 °CCopper C12200 · Thermal expansion: typical, mean 20-100 °CCopper C12200 · Specific heat: typical, 20 °CCopper C12200 · Melting point: liquidus
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
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Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyCopper C12200 · Poisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Copper C12200?
Copper C10100 is stronger: its yield strength is 69 MPa against 69 MPa for Copper C12200 (0%).
Which is lighter, Copper C10100 or Copper C12200?
Copper C10100 is lighter: 8,941 kg/m³ against 8,941 kg/m³ for Copper C12200.
Which is stiffer, Copper C10100 or Copper C12200?
Copper C10100 is stiffer: Young's modulus 117 GPa against 117 GPa for Copper C12200, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Copper C12200?
For the same stiffness or strength they weigh about the same.
Part that must be
Copper C10100
Copper C12200
Stiff rod or tie (tension)
about equal
about equal
Stiff beam (bending)
about equal
about equal
Stiff panel or plate
about equal
about equal
Strong rod or tie
about equal
about equal
Strong beam
about equal
about equal
Strong panel or plate
about equal
about equal
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or Copper C12200?
Copper C10100 conducts heat better: 391 W/m·K against 339 W/m·K for Copper C12200.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 16.9 µm/m·K for Copper C12200.