Materials / Compare
Aluminum ADC12 vs. PCB Laminate FR-4
Compare Aluminum ADC12 vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 149MPasourceone test result, 0.2% proof stress, as cast, ASTM tensile bar (Daiki) | not given (tensile used) |
| Ultimate tensile strength | 345MPasourceone test result, as cast, ASTM tensile bar (Daiki) | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | not sourced | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | 2.3%sourceone test result, as cast, ASTM tensile bar (Daiki) | not sourced |
| Young's modulus (stiffness) | 79.8GPasourcestandard value (S.S.Aluminum) | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 2,680kg/m³sourcemeasured (Daiki) | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | 55.6kN·m/kg | 164kN·m/kg2.95x higher |
| Stiffness to weight | 29.8MN·m/kg2.4x higher | 12.4MN·m/kg |
| Poisson's ratio | not sourced | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | not sourced | 10.2GPa |
| Bulk modulus | not sourced | 12.2GPa |
| Speed of sound | 5,457m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 125W/m·Ksourcemeasured on specimens cut from a 50 x 100 x 5 mm flat die casting (Daiki) | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 21µm/m·Ksourcemeasured, temperature range not stated (Daiki) | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 105µm growth | 67.5µm growth1.56x less |
| Specific heat | 911J/kg·Ksourcemeasured (Daiki) | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 51.2mm²/s319x faster | 0.16mm²/s |
| Thermal shock resistance | not sourced | 324W/m |
| Melting point | 515–582°Csourcesolidus-liquidus (Daiki) | not sourced |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | JIS ADC12 (Al-Si-Cu, about A383 / EN AC-46100) high-pressure die-casting alloy, as cast; physical properties from Daiki Aluminium Industry (ADC12 ingot producer) measured values; modulus from S.S.Aluminum (ADC12 ingot producer) standard values. | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Aluminum ADC12 stronger than PCB Laminate FR-4?
PCB Laminate FR-4 is stronger: its tensile strength is 315 MPa against yield strength 149 MPa for Aluminum ADC12 (2.12x).
Which is lighter, Aluminum ADC12 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 2,680 kg/m³ for Aluminum ADC12.
Which is stiffer, Aluminum ADC12 or PCB Laminate FR-4?
Aluminum ADC12 is stiffer: Young's modulus 79.8 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Aluminum ADC12 deflects less under the same load.
Which is lighter for the same job, Aluminum ADC12 or PCB Laminate FR-4?
For the same stiffness or strength: Aluminum ADC12 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate; PCB Laminate FR-4 is lighter for a strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Aluminum ADC12 | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2.4x heavier |
| Stiff beam (bending) | lighter | 31% heavier |
| Stiff panel or plate | lighter | 7% heavier |
| Strong rod or tie | 2.95x heavier | lighter |
| Strong beam | 2.3x heavier | lighter |
| Strong panel or plate | 2.03x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Aluminum ADC12 or PCB Laminate FR-4?
Aluminum ADC12 conducts heat better: 125 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 21 µm/m·K for Aluminum ADC12.