Materials / Compare
Ceramic Aluminum Nitride vs. PCB Laminate FR-4
Compare Ceramic Aluminum Nitride vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA panel to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not sourced | not given (tensile used) |
| Ultimate tensile strength | not sourced | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | 310MPasource3-point bending strength (JIS R 1601) | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | not sourced | not sourced |
| Young's modulus (stiffness) | 320GPasourcetypical (JIS R 1602) | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 3,400kg/m³sourcetypical (JIS R 1634) | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | not sourced | 164kN·m/kg |
| Stiffness to weight | 94.1MN·m/kg7.57x higher | 12.4MN·m/kg |
| Poisson's ratio | 0.24sourcetypical (JIS R 1602) | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | 129GPa12.7x stiffer in shear | 10.2GPa |
| Bulk modulus | 205GPa | 12.2GPa |
| Speed of sound | 9,701m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 150W/m·Ksourcetypical (JIS R 1611) | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 4.6µm/m·Ksourcemean, 40-400 °C (JIS R 1618) | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 23µm growth2.93x less | 67.5µm growth |
| Specific heat | 710J/kg·Ksourcetypical (JIS R 1611) | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 62.1mm²/s388x faster | 0.16mm²/s |
| Thermal shock resistance | not sourced | 324W/m |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | KYOCERA AN216A dense sintered aluminium nitride, typical values; KYOCERA Fineceramics Europe data sheet 2023.04.03 | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Which is lighter, Ceramic Aluminum Nitride or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 3,400 kg/m³ for Ceramic Aluminum Nitride.
Which is stiffer, Ceramic Aluminum Nitride or PCB Laminate FR-4?
Ceramic Aluminum Nitride is stiffer: Young's modulus 320 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Ceramic Aluminum Nitride deflects less under the same load.
Which is lighter for the same job, Ceramic Aluminum Nitride or PCB Laminate FR-4?
For the same stiffness or strength: Ceramic Aluminum Nitride is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
| Part that must be | Ceramic Aluminum Nitride | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 7.57x heavier |
| Stiff beam (bending) | lighter | 2.07x heavier |
| Stiff panel or plate | lighter | 34% heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Ceramic Aluminum Nitride or PCB Laminate FR-4?
Ceramic Aluminum Nitride conducts heat better: 150 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
Ceramic Aluminum Nitride expands less: 4.6 µm/m·K against 13.5 µm/m·K for PCB Laminate FR-4.
Among 72 materials
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