Materials / Compare
Copper C110 vs. Glass
Compare Copper C110 vs. Glass strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | not given (tensile used) |
| Ultimate tensile strength | 221MPasourcetypical | 41MPasourcetypical mean surface tensile stress at fracture (MOR), 60 s load, weathered, 50% breakage probability |
| Flexural strength | not sourced | 41MPasourcemean MOR (same value as tensile) |
| Elongation at break | 55%sourcetypical, 1 in. rod | not sourced |
| Young's modulus (stiffness) | 117GPasourcetypical1.63x stiffer | 72GPasourcetypical |
| Density | 8,913kg/m³sourcenominal | 2,500kg/m³sourcetypical |
| Strength to weight | 7.74kN·m/kg | 16.4kN·m/kg2.12x higher |
| Stiffness to weight | 13.1MN·m/kg | 28.8MN·m/kg2.19x higher |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | 0.22sourcetypical |
| Shear modulus | 43.7GPa48% stiffer in shear | 29.5GPa |
| Bulk modulus | 122GPa | 42.9GPa |
| Speed of sound | 3,626m/s | 5,367m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 0.937W/m·Ksourcetypical at 75 F |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 8.3µm/m·Ksourcetypical, 75-575 F |
| 100 mm part over a 50 °C swing | 84.5µm growth | 41.5µm growth2.04x less |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | 880J/kg·Ksourcetypical at 75 F |
| Heats up and cools (diffusivity) | 114mm²/s267x faster | 0.426mm²/s |
| Thermal shock resistance | 8,992W/m179x more resistant | 50.1W/m |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Max service temperature | not sourced | 511°Csourcestrain point (ASTM C336) - stress-relaxation onset, not a rated service limit |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | Annealed soda-lime-silica float glass, Pilkington North America Technical Bulletin ATS-129 (04/2025) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Copper C110 stronger than Glass?
Copper C110 is stronger: its yield strength is 69 MPa against tensile strength 41 MPa for Glass (1.68x).
Which is lighter, Copper C110 or Glass?
Glass is lighter: 2,500 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or Glass?
Copper C110 is stiffer: Young's modulus 117 GPa against 72 GPa for Glass, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or Glass?
For the same stiffness or strength: Glass is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | Glass |
|---|---|---|
| Stiff rod or tie (tension) | 2.19x heavier | lighter |
| Stiff beam (bending) | 2.79x heavier | lighter |
| Stiff panel or plate | 3.03x heavier | lighter |
| Strong rod or tie | 2.12x heavier | lighter |
| Strong beam | 2.52x heavier | lighter |
| Strong panel or plate | 2.75x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or Glass?
Copper C110 conducts heat better: 391 W/m·K against 0.937 W/m·K for Glass.
Which expands less with temperature?
Glass expands less: 8.3 µm/m·K against 16.9 µm/m·K for Copper C110.