Materials / Compare
Copper C110 vs. Titanium
Compare Copper C110 vs. Titanium strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | 885MPasourcetypical, plate (>0.187 in), annealed, 0.2% offset |
| Ultimate tensile strength | 221MPasourcetypical | 940MPasourcetypical, plate, annealed |
| Elongation at break | 55%sourcetypical, 1 in. rod | 16%sourcetypical, in 2 in., plate annealed |
| Young's modulus (stiffness) | 117GPasourcetypical | 107–122GPasourcetypical range, 20 °C |
| Density | 8,913kg/m³sourcenominal | 4,430kg/m³sourcenominal2.01x lighter |
| Strength to weight | 7.74kN·m/kg | 200kN·m/kg25.8x higher |
| Stiffness to weight | 13.1MN·m/kg | 25.8MN·m/kg1.97x higher |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | 0.342sourcemean of TIMET measurements |
| Shear modulus | 43.7GPa3% stiffer in shear | 42.7GPa |
| Bulk modulus | 122GPa | 121GPa |
| Speed of sound | 3,626m/s | 5,084m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 6.6W/m·Ksourcetypical, 20 °C, mill annealed |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 9µm/m·Ksourcetypical, mean 0-100 °C |
| 100 mm part over a 50 °C swing | 84.5µm growth | 45µm growth1.88x less |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | 580J/kg·Ksourcetypical, 20 °C |
| Heats up and cools (diffusivity) | 114mm²/s44.3x faster | 2.57mm²/s |
| Thermal shock resistance | 8,992W/m2.41x more resistant | 3,730W/m |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | 1,630–1,650°Csourcemelting range |
| Max service temperature | not sourced | 400°Csourceupper recommended use temperature |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | TIMETAL 6-4 (Ti-6Al-4V Grade 5) annealed plate typical (TIMET properties manual) + TIMET datasheet TMC-0150 physical properties |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Copper C110 stronger than Titanium?
Titanium is stronger: its yield strength is 885 MPa against 69 MPa for Copper C110 (12.8x).
Which is lighter, Copper C110 or Titanium?
Titanium is lighter: 4,430 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or Titanium?
Copper C110 is stiffer: Young's modulus 117 GPa against 115 GPa for Titanium, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or Titanium?
For the same stiffness or strength: Titanium is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | Titanium |
|---|---|---|
| Stiff rod or tie (tension) | 1.97x heavier | lighter |
| Stiff beam (bending) | 1.99x heavier | lighter |
| Stiff panel or plate | 2x heavier | lighter |
| Strong rod or tie | 25.8x heavier | lighter |
| Strong beam | 11x heavier | lighter |
| Strong panel or plate | 7.21x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or Titanium?
Copper C110 conducts heat better: 391 W/m·K against 6.6 W/m·K for Titanium.
Which expands less with temperature?
Titanium expands less: 9 µm/m·K against 16.9 µm/m·K for Copper C110.