Materials / Compare
Aluminum 7075-T6 vs. PCB Laminate FR-4
Compare Aluminum 7075-T6 vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 503MPasourcetypical, 0.2% offset, .500 in dia specimen | not given (tensile used) |
| Ultimate tensile strength | 572MPasourcetypical | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | not sourced | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | 11%sourcetypical, in 4D | not sourced |
| Young's modulus (stiffness) | 71GPasourcetypical | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 2,800kg/m³sourcenominal | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | 180kN·m/kg9% higher | 164kN·m/kg |
| Stiffness to weight | 25.4MN·m/kg2.04x higher | 12.4MN·m/kg |
| Poisson's ratio | 0.33sourcetypical (handbook physical constant) | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | 26.7GPa2.63x stiffer in shear | 10.2GPa |
| Bulk modulus | 69.6GPa | 12.2GPa |
| Speed of sound | 5,036m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 130W/m·Ksourcetypical, 20 °C, T651 | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 23.4µm/m·Ksourcetypical, mean 20-100 °C | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 117µm growth | 67.5µm growth1.73x less |
| Specific heat | 960J/kg·Ksourcetypical, at 100 °C | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 48.4mm²/s302x faster | 0.16mm²/s |
| Thermal shock resistance | 26,370W/m81.5x more resistant | 324W/m |
| Melting point | 532–635°Csourcemelting range | not sourced |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | 7075-T6/T651, Kaiser Aluminum rod & bar (mechanical) and sheet/coil/plate (physical) typical datasheets; Poisson from MIL-HDBK-5J | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Aluminum 7075-T6 stronger than PCB Laminate FR-4?
Aluminum 7075-T6 is stronger: its yield strength is 503 MPa against tensile strength 315 MPa for PCB Laminate FR-4 (1.59x).
Which is lighter, Aluminum 7075-T6 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 2,800 kg/m³ for Aluminum 7075-T6.
Which is stiffer, Aluminum 7075-T6 or PCB Laminate FR-4?
Aluminum 7075-T6 is stiffer: Young's modulus 71 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Aluminum 7075-T6 deflects less under the same load.
Which is lighter for the same job, Aluminum 7075-T6 or PCB Laminate FR-4?
For the same stiffness or strength: Aluminum 7075-T6 is lighter for a stiff rod or tie (tension), stiff beam (bending), strong rod or tie; PCB Laminate FR-4 is lighter for a stiff panel or plate, strong beam, strong panel or plate.
| Part that must be | Aluminum 7075-T6 | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2.04x heavier |
| Stiff beam (bending) | lighter | 18% heavier |
| Stiff panel or plate | 1% heavier | lighter |
| Strong rod or tie | lighter | 9% heavier |
| Strong beam | 7% heavier | lighter |
| Strong panel or plate | 15% heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Aluminum 7075-T6 or PCB Laminate FR-4?
Aluminum 7075-T6 conducts heat better: 130 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 23.4 µm/m·K for Aluminum 7075-T6.