Materials / Compare
Brass C260 vs. Copper C110
Compare Brass C260 vs. Copper C110 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 345MPasourcenominal, strip/flat, 0.5% extension (not 0.2% offset) | 69MPasourcetypical, 0.5% extension under load |
| Ultimate tensile strength | 427MPasourcenominal, strip/flat | 221MPasourcetypical |
| Elongation at break | 23%sourcenominal, in 2.0 in., strip/flat | 55%sourcetypical, 1 in. rod |
| Young's modulus (stiffness) | 110GPasourcetypical, temper-independent | 117GPasourcetypical |
| Density | 8,525kg/m³sourcenominal | 8,913kg/m³sourcenominal |
| Strength to weight | 40.5kN·m/kg5.23x higher | 7.74kN·m/kg |
| Stiffness to weight | 12.9MN·m/kg | 13.1MN·m/kg2% higher |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-M30 = CuZn30 = C26000, rolled products) | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) |
| Shear modulus | 41.2GPa | 43.7GPa6% stiffer in shear |
| Bulk modulus | 115GPa | 122GPa |
| Speed of sound | 3,597m/s | 3,626m/s |
| Thermal | ||
| Thermal conductivity | 121W/m·Ksourcetypical, 20 °C | 391W/m·Ksourcetypical, 20 °C3.23x more heat through a fin |
| Thermal expansion | 20µm/m·Ksourcetypical, mean 20-300 °C | 16.9µm/m·Ksourcetypical, mean 20-100 °C |
| 100 mm part over a 50 °C swing | 100µm growth | 84.5µm growth18% less |
| Specific heat | 377J/kg·Ksourcetypical, 20 °C | 385J/kg·Ksourcetypical, 20 °C |
| Heats up and cools (diffusivity) | 37.7mm²/s | 114mm²/s3.02x faster |
| Thermal shock resistance | 12,510W/m39% more resistant | 8,992W/m |
| Melting point | 916–954°Csourcesolidus-liquidus | 1,065–1,083°Csourcesolidus-liquidus |
| Values for | C26000 cartridge brass, H02 half hard flat/strip: CDA Electronic Connector Design Guide (mechanical) + CDA alloy page (physical) | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Brass C260 stronger than Copper C110?
Brass C260 is stronger: its yield strength is 345 MPa against 69 MPa for Copper C110 (5x).
Which is lighter, Brass C260 or Copper C110?
Brass C260 is lighter: 8,525 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Brass C260 or Copper C110?
Copper C110 is stiffer: Young's modulus 117 GPa against 110 GPa for Brass C260, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Brass C260 or Copper C110?
For the same stiffness or strength: Brass C260 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate; Copper C110 is lighter for a stiff rod or tie (tension).
| Part that must be | Brass C260 | Copper C110 |
|---|---|---|
| Stiff rod or tie (tension) | 2% heavier | lighter |
| Stiff beam (bending) | lighter | 1% heavier |
| Stiff panel or plate | lighter | 2% heavier |
| Strong rod or tie | lighter | 5.23x heavier |
| Strong beam | lighter | 3.06x heavier |
| Strong panel or plate | lighter | 2.34x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Brass C260 or Copper C110?
Copper C110 conducts heat better: 391 W/m·K against 121 W/m·K for Brass C260.
Which expands less with temperature?
Copper C110 expands less: 16.9 µm/m·K against 20 µm/m·K for Brass C260.