Materials / Compare
Brass C260 vs. PCB Laminate FR-4
Compare Brass C260 vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 345MPasourcenominal, strip/flat, 0.5% extension (not 0.2% offset) | not given (tensile used) |
| Ultimate tensile strength | 427MPasourcenominal, strip/flat | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | not sourced | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | 23%sourcenominal, in 2.0 in., strip/flat | not sourced |
| Young's modulus (stiffness) | 110GPasourcetypical, temper-independent | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 8,525kg/m³sourcenominal | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | 40.5kN·m/kg | 164kN·m/kg4.06x higher |
| Stiffness to weight | 12.9MN·m/kg4% higher | 12.4MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-M30 = CuZn30 = C26000, rolled products) | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | 41.2GPa4.05x stiffer in shear | 10.2GPa |
| Bulk modulus | 115GPa | 12.2GPa |
| Speed of sound | 3,597m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 121W/m·Ksourcetypical, 20 °C | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 20µm/m·Ksourcetypical, mean 20-300 °C | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 100µm growth | 67.5µm growth48% less |
| Specific heat | 377J/kg·Ksourcetypical, 20 °C | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 37.7mm²/s235x faster | 0.16mm²/s |
| Thermal shock resistance | 12,510W/m38.7x more resistant | 324W/m |
| Melting point | 916–954°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | C26000 cartridge brass, H02 half hard flat/strip: CDA Electronic Connector Design Guide (mechanical) + CDA alloy page (physical) | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Brass C260 stronger than PCB Laminate FR-4?
Brass C260 is stronger: its yield strength is 345 MPa against tensile strength 315 MPa for PCB Laminate FR-4 (9%).
Which is lighter, Brass C260 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 8,525 kg/m³ for Brass C260.
Which is stiffer, Brass C260 or PCB Laminate FR-4?
Brass C260 is stiffer: Young's modulus 110 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Brass C260 deflects less under the same load.
Which is lighter for the same job, Brass C260 or PCB Laminate FR-4?
For the same stiffness or strength: Brass C260 is lighter for a stiff rod or tie (tension); PCB Laminate FR-4 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Brass C260 | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 4% heavier |
| Stiff beam (bending) | 2.07x heavier | lighter |
| Stiff panel or plate | 2.67x heavier | lighter |
| Strong rod or tie | 4.06x heavier | lighter |
| Strong beam | 4.18x heavier | lighter |
| Strong panel or plate | 4.25x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Brass C260 or PCB Laminate FR-4?
Brass C260 conducts heat better: 121 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 20 µm/m·K for Brass C260.