Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Ceramic Seal Material Properties (01899 F)CoorsTekarchived copyCeramic Alumina 96% · Ultimate tensile strength: typical tensile strength, 25 °C (ACMA Test #4)Ceramic Alumina 96% · Compressive strength: typical, 20 °C (ASTM-C773)Ceramic Alumina 96% · Flexural strength: flexural strength (MOR), 20 °C (ASTM-F417)Ceramic Alumina 96% · Young's modulus (stiffness): typical, 20 °C (ASTM-C848)Ceramic Alumina 96% · Density: typical (ASTM-C20)Ceramic Alumina 96% · Poisson's ratio: typical, 20 °C (ASTM-C848)Ceramic Alumina 96% · Thermal conductivity: typical, 20 °C (ASTM-C408)Ceramic Alumina 96% · Thermal expansion: mean, 25-1000 °C (ASTM-C372)Ceramic Alumina 96% · Specific heat: typical, 100 °C (ASTM-E1269)
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Ceramic Alumina 96% stronger than Copper C10100?
Ceramic Alumina 96% is stronger: its tensile strength is 221 MPa against yield strength 69 MPa for Copper C10100 (3.2x).
Which is lighter, Ceramic Alumina 96% or Copper C10100?
Ceramic Alumina 96% is lighter: 3,720 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Ceramic Alumina 96% or Copper C10100?
Ceramic Alumina 96% is stiffer: Young's modulus 303 GPa against 117 GPa for Copper C10100, so the same part in Ceramic Alumina 96% deflects less under the same load.
Which is lighter for the same job, Ceramic Alumina 96% or Copper C10100?
For the same stiffness or strength: Ceramic Alumina 96% is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Ceramic Alumina 96%
Copper C10100
Stiff rod or tie (tension)
lighter
6.21x heavier
Stiff beam (bending)
lighter
3.86x heavier
Stiff panel or plate
lighter
3.3x heavier
Strong rod or tie
lighter
7.7x heavier
Strong beam
lighter
5.22x heavier
Strong panel or plate
lighter
4.3x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Ceramic Alumina 96% or Copper C10100?
Copper C10100 conducts heat better: 391 W/m·K against 24.7 W/m·K for Ceramic Alumina 96%.
Which expands less with temperature?
Ceramic Alumina 96% expands less: 8.2 µm/m·K against 16.9 µm/m·K for Copper C10100.