Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, KYOCERA Fineceramics Europe, Wieland
Ceramic Aluminum Nitride
KYOCERA AN216A dense sintered aluminium nitride, typical values; KYOCERA Fineceramics Europe data sheet 2023.04.03
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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AN216A Aluminium Nitride Data Sheet (2023)KYOCERA Fineceramics Europearchived copyCeramic Aluminum Nitride · Flexural strength: 3-point bending strength (JIS R 1601)Ceramic Aluminum Nitride · Young's modulus (stiffness): typical (JIS R 1602)Ceramic Aluminum Nitride · Density: typical (JIS R 1634)Ceramic Aluminum Nitride · Poisson's ratio: typical (JIS R 1602)Ceramic Aluminum Nitride · Thermal conductivity: typical (JIS R 1611)Ceramic Aluminum Nitride · Thermal expansion: mean, 40-400 °C (JIS R 1618)Ceramic Aluminum Nitride · Specific heat: typical (JIS R 1611)
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Which is lighter, Ceramic Aluminum Nitride or Copper C10100?
Ceramic Aluminum Nitride is lighter: 3,400 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Ceramic Aluminum Nitride or Copper C10100?
Ceramic Aluminum Nitride is stiffer: Young's modulus 320 GPa against 117 GPa for Copper C10100, so the same part in Ceramic Aluminum Nitride deflects less under the same load.
Which is lighter for the same job, Ceramic Aluminum Nitride or Copper C10100?
For the same stiffness or strength: Ceramic Aluminum Nitride is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
Part that must be
Ceramic Aluminum Nitride
Copper C10100
Stiff rod or tie (tension)
lighter
7.18x heavier
Stiff beam (bending)
lighter
4.35x heavier
Stiff panel or plate
lighter
3.68x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Ceramic Aluminum Nitride or Copper C10100?
Copper C10100 conducts heat better: 391 W/m·K against 150 W/m·K for Ceramic Aluminum Nitride.
Which expands less with temperature?
Ceramic Aluminum Nitride expands less: 4.6 µm/m·K against 16.9 µm/m·K for Copper C10100.