KYOCERA AN216A dense sintered aluminium nitride, typical values; KYOCERA Fineceramics Europe data sheet 2023.04.03
BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Which is lighter, Ceramic Aluminum Nitride or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 3,400 kg/m³ for Ceramic Aluminum Nitride.
Which is stiffer, Ceramic Aluminum Nitride or FDM HIPS?
Ceramic Aluminum Nitride is stiffer: Young's modulus 320 GPa against 1.59 GPa for FDM HIPS, so the same part in Ceramic Aluminum Nitride deflects less under the same load.
Which is lighter for the same job, Ceramic Aluminum Nitride or FDM HIPS?
For the same stiffness or strength: Ceramic Aluminum Nitride is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
Part that must be
Ceramic Aluminum Nitride
FDM HIPS
Stiff rod or tie (tension)
lighter
60.6x heavier
Stiff beam (bending)
lighter
4.27x heavier
Stiff panel or plate
lighter
1.76x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Ceramic Aluminum Nitride or FDM HIPS?
Ceramic Aluminum Nitride conducts heat better: 150 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Ceramic Aluminum Nitride expands less: 4.6 µm/m·K against 80 µm/m·K for FDM HIPS.