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Concrete vs. PCB Board FR-4, 2 copper planes

Compare Concrete vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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ConcreteCast
PCB Board FR-4, 2 copper planesComposite
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Mechanical
Yield strengthnot sourcednot given (tensile used)
Ultimate tensile strengthnot sourced246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Compressive strength27.6MPasourcespecified compressive strength class (f'c), not a measured typicalnot sourced
Elongation at breaknot sourcednot sourced
Young's modulus (stiffness)not sourced21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density2,240–2,400kg/m³sourcerange for normalweight concretenot sourced
Strength to weightnot sourcednot sourced
Stiffness to weightnot sourcednot sourced
Poisson's ratio0.15–0.2sourcegeneral range at normal ambient conditions (overall 0.11-0.32)0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulusnot sourced10.2GPa
Bulk modulusnot sourced12.2GPa
Speed of soundnot sourcednot sourced
Thermal
Thermal conductivity0.9W/m·Ksourcetypical (comparative value)not sourced
Thermal expansion8–12µm/m·Ksourcetypical range for portland cement concrete (aggregate dependent)13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing50µm growth35% less67.5µm growth
Specific heat900J/kg·Ksourcetypical (NIST guidance for thermal analysis)not sourced
Heats up and cools (diffusivity)0.431mm²/snot sourced
Thermal shock resistancenot sourcednot sourced
Max service temperature65°Csourcecode long-term temperature limit (ASME Code, concrete containments)not sourced
Values forNormal-weight portland cement concrete, strength class f'c = 4000 psi (28 MPa) per NRMCA CIP 35; density NRMCA CIP 36; thermal conductivity USDA FPL Wood Handbook; service temperature ORNL/NRC reviewA whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Which expands less with temperature?

Concrete expands less: 10 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.

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Stiffness against density
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30
Strength against density

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