Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, Pilkington North America, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Glass
Annealed soda-lime-silica float glass, Pilkington North America Technical Bulletin ATS-129 (04/2025)
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Technical Bulletin ATS-129: Properties of Soda-Lime Silica Float Glass (2025)Pilkington North Americaarchived copyGlass · Ultimate tensile strength: typical mean surface tensile stress at fracture (MOR), 60 s load, weathered, 50% breakage probabilityGlass · Flexural strength: mean MOR (same value as tensile)Glass · Young's modulus (stiffness): typicalGlass · Density: typicalGlass · Poisson's ratio: typicalGlass · Thermal conductivity: typical at 75 FGlass · Thermal expansion: typical, 75-575 FGlass · Specific heat: typical at 75 FGlass · Max service temperature: strain point (ASTM C336) - stress-relaxation onset, not a rated service limit
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Glass?
Copper C10100 is stronger: its yield strength is 69 MPa against tensile strength 41 MPa for Glass (1.68x).
Which is lighter, Copper C10100 or Glass?
Glass is lighter: 2,500 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or Glass?
Copper C10100 is stiffer: Young's modulus 117 GPa against 72 GPa for Glass, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Glass?
For the same stiffness or strength: Glass is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
Glass
Stiff rod or tie (tension)
2.2x heavier
lighter
Stiff beam (bending)
2.8x heavier
lighter
Stiff panel or plate
3.04x heavier
lighter
Strong rod or tie
2.13x heavier
lighter
Strong beam
2.53x heavier
lighter
Strong panel or plate
2.76x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or Glass?
Copper C10100 conducts heat better: 391 W/m·K against 0.937 W/m·K for Glass.
Which expands less with temperature?
Glass expands less: 8.3 µm/m·K against 16.9 µm/m·K for Copper C10100.