Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources5 documents: Copper Development Association, USDA Forest Products Laboratory, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Wood
Northern red oak (Quercus rubra), clear straight-grained specimens at 12% MC, parallel to grain unless stated; USDA FPL Wood Handbook FPL-GTR-282 (2021) Ch. 4 and Ch. 5
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
Wood Handbook (FPL-GTR-282), Chapter 5: Mechanical Properties of WoodUSDA Forest Products LaboratoryWood · Ultimate tensile strength: modulus of rupture (no direct tensile value)Wood · Compressive strength: compression parallel to grain (maximum crushing strength), 12% MCWood · Flexural strength: modulus of rupture (static bending), 12% MCWood · Young's modulus (stiffness): bending MOE, parallel to grainWood · Poisson's ratio: mu_LR (red oak group, ~12% MC)
3
Technical Note 218: Weights of Various Woods Grown in the United States (1953)USDA Forest Products LaboratoryWood · Density: average weight of clear wood at 8% and 15% moisture content
4
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
5
Wood Handbook (FPL-GTR-282), Chapter 4: Moisture Relations and Physical Properties of WoodUSDA Forest Products LaboratoryWood · Thermal conductivity: across grain, 12% MC (Table 4-7, approximate)Wood · Thermal expansion: parallel to grain, ovendry wood, range across speciesWood · Specific heat: solid wood (all species), 12% MC, 27 C
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Wood?
Wood is stronger: its tensile strength is 99 MPa against yield strength 69 MPa for Copper C10100 (43%).
Which is lighter, Copper C10100 or Wood?
Wood is lighter: 692 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or Wood?
Copper C10100 is stiffer: Young's modulus 117 GPa against 12.5 GPa for Wood, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Wood?
For the same stiffness or strength: Wood is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
Wood
Stiff rod or tie (tension)
38% heavier
lighter
Stiff beam (bending)
4.22x heavier
lighter
Stiff panel or plate
6.13x heavier
lighter
Strong rod or tie
18.6x heavier
lighter
Strong beam
16.4x heavier
lighter
Strong panel or plate
15.5x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or Wood?
Copper C10100 conducts heat better: 391 W/m·K against 0.18 W/m·K for Wood.
Which expands less with temperature?
Wood expands less: 3.8 µm/m·K against 16.9 µm/m·K for Copper C10100.