Materials / Compare
Copper C110 vs. FDM ASA
Compare Copper C110 vs. FDM ASA strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | not given (tensile used) |
| Ultimate tensile strength | 221MPasourcetypical5.97x stronger | 37MPasourcetypical |
| Flexural strength | not sourced | 65MPasourcetypical |
| Elongation at break | 55%sourcetypical, 1 in. rod | 9.2%sourcetypical |
| Young's modulus (stiffness) | 117GPasourcetypical47.8x stiffer | 2.45GPasourcetypical |
| Density | 8,913kg/m³sourcenominal | 1,050kg/m³sourcetypical |
| Strength to weight | 7.74kN·m/kg | 35.2kN·m/kg4.55x higher |
| Stiffness to weight | 13.1MN·m/kg5.64x higher | 2.33MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | not sourced |
| Shear modulus | 43.7GPa | not sourced |
| Bulk modulus | 122GPa | not sourced |
| Speed of sound | 3,626m/s | 1,528m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 0.17W/m·Ksourcebase material: INEOS Styrolution Luran S 777K injection-molding ASA, typical |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 80–110µm/m·Ksourcebase material: INEOS Styrolution Luran S 777K injection-molding ASA, range |
| 100 mm part over a 50 °C swing | 84.5µm growth5.62x less | 475µm growth |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 114mm²/s | not sourced |
| Thermal shock resistance | 8,992W/m | not sourced |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Max service temperature | not sourced | 92°CsourceHDT 1.8 MPa |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | Bambu Lab ASA, TDS V3.0, printed specimens X-Y; nozzle 260 °C, bed 80 °C, 200 mm/s, 100% infill; annealed and dried 80 °C for 12 h before testing. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM ASA is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Copper C110 stronger than FDM ASA?
Copper C110 is stronger: its yield strength is 69 MPa against tensile strength 37 MPa for FDM ASA (1.86x).
Which is lighter, Copper C110 or FDM ASA?
FDM ASA is lighter: 1,050 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or FDM ASA?
Copper C110 is stiffer: Young's modulus 117 GPa against 2.45 GPa for FDM ASA, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or FDM ASA?
For the same stiffness or strength: Copper C110 is lighter for a stiff rod or tie (tension); FDM ASA is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | FDM ASA |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 5.64x heavier |
| Stiff beam (bending) | 23% heavier | lighter |
| Stiff panel or plate | 2.34x heavier | lighter |
| Strong rod or tie | 4.55x heavier | lighter |
| Strong beam | 5.6x heavier | lighter |
| Strong panel or plate | 6.22x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or FDM ASA?
Copper C110 conducts heat better: 391 W/m·K against 0.17 W/m·K for FDM ASA.
Which expands less with temperature?
Copper C110 expands less: 16.9 µm/m·K against 95 µm/m·K for FDM ASA.