Materials / Compare
Copper C110 vs. PCB Laminate FR-4
Compare Copper C110 vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | not given (tensile used) |
| Ultimate tensile strength | 221MPasourcetypical | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | not sourced | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | 55%sourcetypical, 1 in. rod | not sourced |
| Young's modulus (stiffness) | 117GPasourcetypical | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 8,913kg/m³sourcenominal | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | 7.74kN·m/kg | 164kN·m/kg21.2x higher |
| Stiffness to weight | 13.1MN·m/kg6% higher | 12.4MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | 43.7GPa4.3x stiffer in shear | 10.2GPa |
| Bulk modulus | 122GPa | 12.2GPa |
| Speed of sound | 3,626m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 84.5µm growth | 67.5µm growth25% less |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 114mm²/s711x faster | 0.16mm²/s |
| Thermal shock resistance | 8,992W/m27.8x more resistant | 324W/m |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Copper C110 stronger than PCB Laminate FR-4?
PCB Laminate FR-4 is stronger: its tensile strength is 315 MPa against yield strength 69 MPa for Copper C110 (4.57x).
Which is lighter, Copper C110 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or PCB Laminate FR-4?
Copper C110 is stiffer: Young's modulus 117 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or PCB Laminate FR-4?
For the same stiffness or strength: Copper C110 is lighter for a stiff rod or tie (tension); PCB Laminate FR-4 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 6% heavier |
| Stiff beam (bending) | 2.09x heavier | lighter |
| Stiff panel or plate | 2.73x heavier | lighter |
| Strong rod or tie | 21.2x heavier | lighter |
| Strong beam | 12.8x heavier | lighter |
| Strong panel or plate | 9.92x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or PCB Laminate FR-4?
Copper C110 conducts heat better: 391 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 16.9 µm/m·K for Copper C110.