Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources5 documents: Copper Development Association, USDA Forest Products Laboratory, Wieland
Copper C12200
C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
C12200 Alloy (copper.org)Copper Development Associationarchived copyCopper C12200 · Yield strength: typical, 0.5% extension under load, 0.065 in. tubeCopper C12200 · Ultimate tensile strength: typical, 0.065 in. tubeCopper C12200 · Elongation at break: typical, 0.065 in. tubeCopper C12200 · Young's modulus (stiffness): typicalCopper C12200 · Density: nominalCopper C12200 · Thermal conductivity: typical, 20 °CCopper C12200 · Thermal expansion: typical, mean 20-100 °CCopper C12200 · Specific heat: typical, 20 °CCopper C12200 · Melting point: liquidus
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Wood Handbook (FPL-GTR-282), Chapter 12: Mechanical Properties of Wood-Based Composite MaterialsUSDA Forest Products LaboratoryPlywood · Ultimate tensile strength: modulus of rupture (no direct tensile value)Plywood · Flexural strength: static bending MOR (Douglas-fir); range 33.72-42.61 across speciesPlywood · Young's modulus (stiffness): static bending MOE of the panel (Douglas-fir); range 6.96-8.55 across species
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Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyCopper C12200 · Poisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
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Thermal Properties of Wood and Wood Panel Products for Use in Buildings (1988)USDA Forest Products Laboratoryarchived copyPlywood · Thermal conductivity: APA-recommended design value (Douglas-fir plywood), as reported by FPL/ORNL
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Wood Handbook (FPL-GTR-282), Chapter 4: Moisture Relations and Physical Properties of WoodUSDA Forest Products LaboratoryPlywood · Thermal expansion: base material: solid wood parallel to grain, ovendry, range across speciesPlywood · Specific heat: base material: solid wood (all species), 12% MC, 27 C
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C12200 stronger than Plywood?
Copper C12200 is stronger: its yield strength is 69 MPa against tensile strength 41.4 MPa for Plywood (1.67x).
Which is stiffer, Copper C12200 or Plywood?
Copper C12200 is stiffer: Young's modulus 117 GPa against 7.45 GPa for Plywood, so the same part in Copper C12200 deflects less under the same load.
Thermal
Which conducts heat better, Copper C12200 or Plywood?
Copper C12200 conducts heat better: 339 W/m·K against 0.12 W/m·K for Plywood.
Which expands less with temperature?
Plywood expands less: 3.8 µm/m·K against 16.9 µm/m·K for Copper C12200.