Materials / Compare

Plywood vs. Solder SAC305

Compare Plywood vs. Solder SAC305 strength, stiffness, weight and thermal properties.

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PlywoodNatural
Solder SAC305Cast
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Mechanical
Yield strengthnot given (tensile used)22MPasourcetypical
Ultimate tensile strength41.4MPasourcemodulus of rupture (no direct tensile value)39.6MPasourcetypical
Flexural strength41.4MPasourcestatic bending MOR (Douglas-fir); range 33.72-42.61 across speciesnot sourced
Elongation at breaknot sourced49%sourcetypical
Young's modulus (stiffness)7.45GPasourcestatic bending MOE of the panel (Douglas-fir); range 6.96-8.55 across species6.9GPasourcetypical, temperature and strain rate not stated
Densitynot sourced7,350kg/m³sourcetypical
Strength to weightnot sourced2.99kN·m/kg
Stiffness to weightnot sourced0.939MN·m/kg
Poisson's rationot sourced0.35sourcetypical
Shear modulusnot sourced2.56GPa
Bulk modulusnot sourced7.67GPa
Speed of soundnot sourced969m/s
Thermal
Thermal conductivity0.12W/m·KsourceAPA-recommended design value (Douglas-fir plywood), as reported by FPL/ORNL61W/m·Ksourcetypical, temperature not stated
Thermal expansion3.1–4.5µm/m·Ksourcebase material: solid wood parallel to grain, ovendry, range across species21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha)
100 mm part over a 50 °C swing19µm growth5.76x less110µm growth
Specific heat1,700J/kg·Ksourcebase material: solid wood (all species), 12% MC, 27 C232J/kg·Ksourcetypical (MacDermid Alpha)
Heats up and cools (diffusivity)not sourced35.8mm²/s
Thermal shock resistancenot sourced5,773W/m
Melting pointnot sourced217–220°Csourcesolidus-liquidus
Values forDouglas-fir plywood sheathing (construction plywood per PS 1), static bending properties from USDA FPL Wood Handbook FPL-GTR-282 Ch. 12 Table 12-2 (Biblis 2000)SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Plywood stronger than Solder SAC305?

Plywood is stronger: its tensile strength is 41.4 MPa against yield strength 22 MPa for Solder SAC305 (1.88x).

Which is stiffer, Plywood or Solder SAC305?

Plywood is stiffer: Young's modulus 7.45 GPa against 6.9 GPa for Solder SAC305, so the same part in Plywood deflects less under the same load.

Which conducts heat better, Plywood or Solder SAC305?

Solder SAC305 conducts heat better: 61 W/m·K against 0.12 W/m·K for Plywood.

Which expands less with temperature?

Plywood expands less: 3.8 µm/m·K against 21.9 µm/m·K for Solder SAC305.

Among 72 materials

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Stiffness against density
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum ADC12Magnesium AZ91DPlastic PBT GF30Plastic PPS GF40Plastic LCP GF30Solder SAC305
Strength against density

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