Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
Try it on a partA bracket to run stress or thermal on, free in your browser
Sources3 documents: Copper Development Association, Formlabs, Wieland
Copper C12200
C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
SLA Resin Tough 2000
Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated.
1
C12200 Alloy (copper.org)Copper Development Associationarchived copyCopper C12200 · Yield strength: typical, 0.5% extension under load, 0.065 in. tubeCopper C12200 · Ultimate tensile strength: typical, 0.065 in. tubeCopper C12200 · Elongation at break: typical, 0.065 in. tubeCopper C12200 · Young's modulus (stiffness): typicalCopper C12200 · Density: nominalCopper C12200 · Thermal conductivity: typical, 20 °CCopper C12200 · Thermal expansion: typical, mean 20-100 °CCopper C12200 · Specific heat: typical, 20 °CCopper C12200 · Melting point: liquidus
Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyCopper C12200 · Poisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C12200 stronger than SLA Resin Tough 2000?
Copper C12200 is stronger: its yield strength is 69 MPa against 40.4 MPa for SLA Resin Tough 2000 (1.71x).
Which is lighter, Copper C12200 or SLA Resin Tough 2000?
SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 8,941 kg/m³ for Copper C12200.
Which is stiffer, Copper C12200 or SLA Resin Tough 2000?
Copper C12200 is stiffer: Young's modulus 117 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Copper C12200 deflects less under the same load.
Which is lighter for the same job, Copper C12200 or SLA Resin Tough 2000?
For the same stiffness or strength: Copper C12200 is lighter for a stiff rod or tie (tension); SLA Resin Tough 2000 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C12200
SLA Resin Tough 2000
Stiff rod or tie (tension)
lighter
7.94x heavier
Stiff beam (bending)
2% heavier
lighter
Stiff panel or plate
2.04x heavier
lighter
Strong rod or tie
4.8x heavier
lighter
Strong beam
5.74x heavier
lighter
Strong panel or plate
6.28x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C12200 or SLA Resin Tough 2000?
SLA Resin Tough 2000 stretches further before it breaks: 79% elongation at break against 45% for Copper C12200.
Thermal
Which expands less with temperature?
Copper C12200 expands less: 16.9 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.