PCB Board FR-4, 2 copper planes vs. Plastic Polypropylene

Compare PCB Board FR-4, 2 copper planes vs. Plastic Polypropylene strength, stiffness, weight and thermal properties.

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PCB Board FR-4, 2 copper planesComposite

Plastic PolypropyleneBulk polymer (molded or machined)

Mechanical
Try it on a partA sample part to run stress or thermal on, free in your browser	Open in LessCAD	Open in LessCAD
Yield strength	not given (tensile used)	33MPasourcetypical, tensile stress at yield ISO 527
Ultimate tensile strength	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)	not sourced
Elongation at break	not sourced	not sourced
Young's modulus (stiffness)	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out	1.45GPasourcetypical, tensile modulus ISO 527
Density	not sourced	900kg/m³sourcetypical, 23 °C ISO 1183-1
Strength to weight	not sourced	36.7kN·m/kg
Stiffness to weight	not sourced	1.61MN·m/kg
Poisson's ratio	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction	0.42sourcebase material: polypropylene homopolymer family (INEOS Olefins & Polymers USA, Typical Engineering Properties of Polypropylene)
Shear modulus	10.2GPa19.9x stiffer in shear	0.511GPa
Bulk modulus	12.2GPa	3.02GPa
Speed of sound	not sourced	1,269m/s
Thermal
Thermal conductivity	not sourced	0.17–0.22W/m·Ksourcebase material: polypropylene homopolymer family (INEOS Olefins & Polymers USA, Typical Engineering Properties of Polypropylene)
Thermal expansion	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)	80–100µm/m·Ksourcebase material: polypropylene homopolymer family (INEOS Olefins & Polymers USA, Typical Engineering Properties of Polypropylene)
100 mm part over a 50 °C swing	67.5µm growth6.67x less	450µm growth
Specific heat	not sourced	not sourced
Heats up and cools (diffusivity)	not sourced	not sourced
Thermal shock resistance	not sourced	28.6W/m
Max service temperature	not sourced	90°CsourceHDT 0.45 MPa (ISO 75B), unannealed
Values for	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.	LyondellBasell Moplen HP501H polypropylene homopolymer (general purpose), typical ISO values

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is PCB Board FR-4, 2 copper planes stronger than Plastic Polypropylene?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 33 MPa for Plastic Polypropylene (9.56x).

Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic Polypropylene?

PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 1.45 GPa for Plastic Polypropylene, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 90 µm/m·K for Plastic Polypropylene.

Among 73 materials

Stiffness against density

Strength against density