Materials / Compare
SLA Resin Tough 2000 vs. Plastic UHMWPE
Compare SLA Resin Tough 2000 vs. Plastic UHMWPE strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 40.4MPasourcetypical | 20MPasourcetypical, tensile stress at yield ISO 527, 50 mm/min |
| Ultimate tensile strength | 40.4MPasourcetypical | 43MPasourcetypical, tensile stress at break ISO 527, 50 mm/min |
| Flexural strength | 67MPasourcetypical | not sourced |
| Elongation at break | 79%sourcetypical | 465%sourcetypical, nominal elongation at break ISO 527 |
| Young's modulus (stiffness) | 1.8GPasourcetypical | 0.66GPasourcetypical, tensile modulus ISO 527, 1 mm/min |
| Density | 1,090kg/m³sourcetypical | 930kg/m³sourcetypical17% lighter |
| Strength to weight | 37.1kN·m/kg1.72x higher | 21.5kN·m/kg |
| Stiffness to weight | 1.65MN·m/kg2.33x higher | 0.71MN·m/kg |
| Poisson's ratio | not sourced | not sourced |
| Shear modulus | not sourced | not sourced |
| Bulk modulus | not sourced | not sourced |
| Speed of sound | 1,285m/s | 842m/s |
| Thermal | ||
| Thermal conductivity | not sourced | 0.4W/m·Ksourcetypical, unfilled (narrative value, generic Celanese UHMWPE) |
| Thermal expansion | 134µm/m·Ksourcemean 0-150 °C | 200µm/m·Ksourcetypical, 20 to 100 °C (generic Celanese UHMWPE) |
| 100 mm part over a 50 °C swing | 671µm growth49% less | 1,000µm growth |
| Specific heat | not sourced | not sourced |
| Heats up and cools (diffusivity) | not sourced | not sourced |
| Thermal shock resistance | not sourced | not sourced |
| Melting point | not sourced | 130–138°CsourceDSC 10 K/min |
| Glass transition | 112°CsourceDMA | not sourced |
| Max service temperature | 57°CsourceHDT 1.8 MPa | 80°Csourcerecommended max constant operating temperature |
| Values for | Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated. | Celanese GUR 4120 (avg. molecular weight 4.7x10^6 g/mol), typical values on compression-molded specimens; CTE and thermal conductivity from Celanese's generic UHMWPE guide (grade not named) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is SLA Resin Tough 2000 stronger than Plastic UHMWPE?
SLA Resin Tough 2000 is stronger: its yield strength is 40.4 MPa against 20 MPa for Plastic UHMWPE (2.02x).
Which is lighter, SLA Resin Tough 2000 or Plastic UHMWPE?
Plastic UHMWPE is lighter: 930 kg/m³ against 1,090 kg/m³ for SLA Resin Tough 2000.
Which is stiffer, SLA Resin Tough 2000 or Plastic UHMWPE?
SLA Resin Tough 2000 is stiffer: Young's modulus 1.8 GPa against 0.66 GPa for Plastic UHMWPE, so the same part in SLA Resin Tough 2000 deflects less under the same load.
Which is lighter for the same job, SLA Resin Tough 2000 or Plastic UHMWPE?
For the same stiffness or strength: SLA Resin Tough 2000 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | SLA Resin Tough 2000 | Plastic UHMWPE |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2.33x heavier |
| Stiff beam (bending) | lighter | 41% heavier |
| Stiff panel or plate | lighter | 19% heavier |
| Strong rod or tie | lighter | 1.72x heavier |
| Strong beam | lighter | 36% heavier |
| Strong panel or plate | lighter | 21% heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which expands less with temperature?
SLA Resin Tough 2000 expands less: 134 µm/m·K against 200 µm/m·K for Plastic UHMWPE.