Materials / Compare
FDM HIPS vs. Plastic UHMWPE
Compare FDM HIPS vs. Plastic UHMWPE strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 20MPasourcetypical, tensile stress at yield ISO 527, 50 mm/min |
| Ultimate tensile strength | 18.4MPasourcetypical | 43MPasourcetypical, tensile stress at break ISO 527, 50 mm/min |
| Flexural strength | 31.8MPasourcetypical | not sourced |
| Elongation at break | 1.4%sourcetypical | 465%sourcetypical, nominal elongation at break ISO 527 |
| Young's modulus (stiffness) | 1.59GPasourcetypical | 0.66GPasourcetypical, tensile modulus ISO 527, 1 mm/min |
| Density | 1,023kg/m³sourcetypical | 930kg/m³sourcetypical |
| Strength to weight | 18kN·m/kg | 21.5kN·m/kg20% higher |
| Stiffness to weight | 1.55MN·m/kg2.19x higher | 0.71MN·m/kg |
| Poisson's ratio | not sourced | not sourced |
| Shear modulus | not sourced | not sourced |
| Bulk modulus | not sourced | not sourced |
| Speed of sound | 1,246m/s | 842m/s |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 0.4W/m·Ksourcetypical, unfilled (narrative value, generic Celanese UHMWPE) |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 200µm/m·Ksourcetypical, 20 to 100 °C (generic Celanese UHMWPE) |
| 100 mm part over a 50 °C swing | 400µm growth2.5x less | 1,000µm growth |
| Specific heat | not sourced | not sourced |
| Heats up and cools (diffusivity) | not sourced | not sourced |
| Thermal shock resistance | not sourced | not sourced |
| Melting point | not sourced | 130–138°CsourceDSC 10 K/min |
| Glass transition | 99°Csourcetypical | not sourced |
| Max service temperature | 86°CsourceHDT 1.8 MPa | 80°Csourcerecommended max constant operating temperature |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | Celanese GUR 4120 (avg. molecular weight 4.7x10^6 g/mol), typical values on compression-molded specimens; CTE and thermal conductivity from Celanese's generic UHMWPE guide (grade not named) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Plastic UHMWPE?
Plastic UHMWPE is stronger: its yield strength is 20 MPa against tensile strength 18.4 MPa for FDM HIPS (9%).
Which is lighter, FDM HIPS or Plastic UHMWPE?
Plastic UHMWPE is lighter: 930 kg/m³ against 1,023 kg/m³ for FDM HIPS.
Which is stiffer, FDM HIPS or Plastic UHMWPE?
FDM HIPS is stiffer: Young's modulus 1.59 GPa against 0.66 GPa for Plastic UHMWPE, so the same part in FDM HIPS deflects less under the same load.
Which is lighter for the same job, FDM HIPS or Plastic UHMWPE?
For the same stiffness or strength: FDM HIPS is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate; Plastic UHMWPE is lighter for a strong rod or tie, strong beam, strong panel or plate.
| Part that must be | FDM HIPS | Plastic UHMWPE |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2.19x heavier |
| Stiff beam (bending) | lighter | 41% heavier |
| Stiff panel or plate | lighter | 22% heavier |
| Strong rod or tie | 20% heavier | lighter |
| Strong beam | 16% heavier | lighter |
| Strong panel or plate | 15% heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, FDM HIPS or Plastic UHMWPE?
Plastic UHMWPE conducts heat better: 0.4 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
FDM HIPS expands less: 80 µm/m·K against 200 µm/m·K for Plastic UHMWPE.