Silicon vs. SLA Resin Tough 2000

Compare Silicon vs. SLA Resin Tough 2000 strength, stiffness, weight and thermal properties.

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SiliconGrown single crystal

SLA Resin Tough 20003D printed (SLA resin)

Mechanical
Try it on a partA sample part to run stress or thermal on, free in your browser	Open in LessCAD	Open in LessCAD
Yield strength	not given (tensile used)	40.4MPasourcetypical
Ultimate tensile strength	130MPasourcemodulus of rupture (bending fracture stress); brittle, no yield point	40.4MPasourcetypical
Flexural strength	130MPasourcemodulus of rupture	67MPasourcetypical
Elongation at break	not sourced	79%sourcetypical
Young's modulus (stiffness)	131GPasourcetypical (single quoted value of an anisotropic crystal)	1.8GPasourcetypical
Density	2,329kg/m³sourcetypical	1,090kg/m³sourcetypical2.14x lighter
Strength to weight	55.8kN·m/kg1.51x higher	37.1kN·m/kg
Stiffness to weight	56.2MN·m/kg34.1x higher	1.65MN·m/kg
Poisson's ratio	0.221sourcetypical	not sourced
Shear modulus	53.6GPa	not sourced
Bulk modulus	78.3GPa	not sourced
Speed of sound	7,500m/s	1,285m/s
Thermal
Thermal conductivity	163W/m·Ksourcetypical at 313 K (40 °C)	not sourced
Thermal expansion	2.62µm/m·Ksourcetypical at 300 K	134µm/m·Ksourcemean 0-150 °C
100 mm part over a 50 °C swing	13.1µm growth51.2x less	671µm growth
Specific heat	732J/kg·Ksourcetypical	not sourced
Heats up and cools (diffusivity)	95.6mm²/s	not sourced
Thermal shock resistance	48,095W/m	not sourced
Melting point	1,412°Csourcetypical	not sourced
Glass transition	not sourced	112°CsourceDMA
Max service temperature	300°Csourceproducer's maximum application temperature (optical components)	57°CsourceHDT 1.8 MPa
Values for	Synthetic single-crystal silicon (cubic, diamond structure), Korth Kristalle (crystal grower) material data; Korth usually supplies Floating Zone (FZ) material, Czochralski (Cz) also offered. Silicon is elastically anisotropic; the producer quotes one modulus and the solver is isotropic.	Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Is Silicon stronger than SLA Resin Tough 2000?

Silicon is stronger: its tensile strength is 130 MPa against yield strength 40.4 MPa for SLA Resin Tough 2000 (3.22x).

Which is lighter, Silicon or SLA Resin Tough 2000?

SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 2,329 kg/m³ for Silicon.

Which is stiffer, Silicon or SLA Resin Tough 2000?

Silicon is stiffer: Young's modulus 131 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Silicon deflects less under the same load.

Which is lighter for the same job, Silicon or SLA Resin Tough 2000?

For the same stiffness or strength: Silicon is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam; SLA Resin Tough 2000 is lighter for a strong panel or plate.

Part that must be	Silicon	SLA Resin Tough 2000
Stiff rod or tie (tension)	lighter	34.1x heavier
Stiff beam (bending)	lighter	3.99x heavier
Stiff panel or plate	lighter	1.95x heavier
Strong rod or tie	lighter	1.51x heavier
Strong beam	lighter	2% heavier
Strong panel or plate	19% heavier	lighter

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which expands less with temperature?

Silicon expands less: 2.62 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.

Among 72 materials

Stiffness against density

Strength against density