Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Kaiser Aluminum, Copper Development Association, U.S. Department of Defense, Wieland
Aluminum 5052-H32
5052-H32, Kaiser Aluminum tube & pipe typical datasheet (mechanical, CTE, melting); MIL-HDBK-5J (Poisson, density, specific heat)
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
1
Alloy 5052 Tube & Pipe Technical DataKaiser Aluminumarchived copyAluminum 5052-H32 · Yield strength: typical, 0.2% offsetAluminum 5052-H32 · Ultimate tensile strength: typicalAluminum 5052-H32 · Elongation at break: typicalAluminum 5052-H32 · Young's modulus (stiffness): typicalAluminum 5052-H32 · Thermal conductivity: base material: 5052 in O temper (same alloy, annealed); Kaiser typicalAluminum 5052-H32 · Thermal expansion: typical, mean 20-100 °CAluminum 5052-H32 · Melting point: melting range
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseAluminum 5052-H32 · Density: nominalAluminum 5052-H32 · Poisson's ratio: typical (handbook physical constant)Aluminum 5052-H32 · Specific heat: at 100 °C (212 °F); table covers O, H32, H34, H36, H38
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum 5052-H32 stronger than Copper C10100?
Aluminum 5052-H32 is stronger: its yield strength is 195 MPa against 69 MPa for Copper C10100 (2.83x).
Which is lighter, Aluminum 5052-H32 or Copper C10100?
Aluminum 5052-H32 is lighter: 2,685 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Aluminum 5052-H32 or Copper C10100?
Copper C10100 is stiffer: Young's modulus 117 GPa against 70 GPa for Aluminum 5052-H32, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Aluminum 5052-H32 or Copper C10100?
For the same stiffness or strength: Aluminum 5052-H32 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Aluminum 5052-H32
Copper C10100
Stiff rod or tie (tension)
lighter
1.99x heavier
Stiff beam (bending)
lighter
2.57x heavier
Stiff panel or plate
lighter
2.8x heavier
Strong rod or tie
lighter
9.41x heavier
Strong beam
lighter
6.66x heavier
Strong panel or plate
lighter
5.6x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Aluminum 5052-H32 or Copper C10100?
Copper C10100 stretches further before it breaks: 45% elongation at break against 12% for Aluminum 5052-H32.
Thermal
Which conducts heat better, Aluminum 5052-H32 or Copper C10100?
Copper C10100 conducts heat better: 391 W/m·K against 138 W/m·K for Aluminum 5052-H32.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 23.8 µm/m·K for Aluminum 5052-H32.