Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Kaiser Aluminum, Copper Development Association, U.S. Department of Defense, Wieland
Aluminum
6061-T6/T651, Kaiser Aluminum typical properties (sheet, coil & plate datasheet); Poisson from MIL-HDBK-5J
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
1
Alloy 6061 Sheet, Coil & Plate Technical DataKaiser Aluminumarchived copyAluminum · Yield strength: typical, 0.2% offset, .500 in dia specimenAluminum · Ultimate tensile strength: typicalAluminum · Elongation at break: typical, in 4D, 0.500 in dia specimenAluminum · Young's modulus (stiffness): typicalAluminum · Density: nominalAluminum · Thermal conductivity: typical, 20 °CAluminum · Thermal expansion: typical, mean 20-100 °CAluminum · Specific heat: typical, at 100 °CAluminum · Melting point: solidus-liquidus
2
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
3
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseAluminum · Poisson's ratio: typical (handbook physical constant)
4
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum stronger than Copper C10100?
Aluminum is stronger: its yield strength is 276 MPa against 69 MPa for Copper C10100 (4x).
Which is lighter, Aluminum or Copper C10100?
Aluminum is lighter: 2,700 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Aluminum or Copper C10100?
Copper C10100 is stiffer: Young's modulus 117 GPa against 68.3 GPa for Aluminum, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Aluminum or Copper C10100?
For the same stiffness or strength: Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Aluminum
Copper C10100
Stiff rod or tie (tension)
lighter
1.93x heavier
Stiff beam (bending)
lighter
2.53x heavier
Stiff panel or plate
lighter
2.77x heavier
Strong rod or tie
lighter
13.2x heavier
Strong beam
lighter
8.34x heavier
Strong panel or plate
lighter
6.62x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Aluminum or Copper C10100?
Copper C10100 stretches further before it breaks: 45% elongation at break against 17% for Aluminum.
Thermal
Which conducts heat better, Aluminum or Copper C10100?
Copper C10100 conducts heat better: 391 W/m·K against 167 W/m·K for Aluminum.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 23.6 µm/m·K for Aluminum.