Materials / Compare
Aluminum vs. FDM HIPS
Compare Aluminum vs. FDM HIPS strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 276MPasourcetypical, 0.2% offset, .500 in dia specimen | not given (tensile used) |
| Ultimate tensile strength | 310MPasourcetypical16.8x stronger | 18.4MPasourcetypical |
| Flexural strength | not sourced | 31.8MPasourcetypical |
| Elongation at break | 17%sourcetypical, in 4D, 0.500 in dia specimen | 1.4%sourcetypical |
| Young's modulus (stiffness) | 68.3GPasourcetypical43x stiffer | 1.59GPasourcetypical |
| Density | 2,700kg/m³sourcenominal | 1,023kg/m³sourcetypical |
| Strength to weight | 102kN·m/kg5.68x higher | 18kN·m/kg |
| Stiffness to weight | 25.3MN·m/kg16.3x higher | 1.55MN·m/kg |
| Poisson's ratio | 0.33sourcetypical (handbook physical constant) | not sourced |
| Shear modulus | 25.7GPa | not sourced |
| Bulk modulus | 67GPa | not sourced |
| Speed of sound | 5,030m/s | 1,246m/s |
| Thermal | ||
| Thermal conductivity | 167W/m·Ksourcetypical, 20 °C | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| Thermal expansion | 23.6µm/m·Ksourcetypical, mean 20-100 °C | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| 100 mm part over a 50 °C swing | 118µm growth3.39x less | 400µm growth |
| Specific heat | 896J/kg·Ksourcetypical, at 100 °C | not sourced |
| Heats up and cools (diffusivity) | 69mm²/s | not sourced |
| Thermal shock resistance | 19,159W/m | not sourced |
| Melting point | 582–652°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 99°Csourcetypical |
| Max service temperature | not sourced | 86°CsourceHDT 1.8 MPa |
| Values for | 6061-T6/T651, Kaiser Aluminum typical properties (sheet, coil & plate datasheet); Poisson from MIL-HDBK-5J | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Aluminum stronger than FDM HIPS?
Aluminum is stronger: its yield strength is 276 MPa against tensile strength 18.4 MPa for FDM HIPS (15x).
Which is lighter, Aluminum or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 2,700 kg/m³ for Aluminum.
Which is stiffer, Aluminum or FDM HIPS?
Aluminum is stiffer: Young's modulus 68.3 GPa against 1.59 GPa for FDM HIPS, so the same part in Aluminum deflects less under the same load.
Which is lighter for the same job, Aluminum or FDM HIPS?
For the same stiffness or strength: Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Aluminum | FDM HIPS |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 16.3x heavier |
| Stiff beam (bending) | lighter | 2.48x heavier |
| Stiff panel or plate | lighter | 33% heavier |
| Strong rod or tie | lighter | 5.68x heavier |
| Strong beam | lighter | 2.3x heavier |
| Strong panel or plate | lighter | 47% heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Aluminum or FDM HIPS?
Aluminum conducts heat better: 167 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Aluminum expands less: 23.6 µm/m·K against 80 µm/m·K for FDM HIPS.