Materials / Compare
Brass C260 vs. FDM HIPS
Compare Brass C260 vs. FDM HIPS strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 345MPasourcenominal, strip/flat, 0.5% extension (not 0.2% offset) | not given (tensile used) |
| Ultimate tensile strength | 427MPasourcenominal, strip/flat | 18.4MPasourcetypical |
| Flexural strength | not sourced | 31.8MPasourcetypical |
| Elongation at break | 23%sourcenominal, in 2.0 in., strip/flat | 1.4%sourcetypical |
| Young's modulus (stiffness) | 110GPasourcetypical, temper-independent | 1.59GPasourcetypical |
| Density | 8,525kg/m³sourcenominal | 1,023kg/m³sourcetypical |
| Strength to weight | 40.5kN·m/kg2.25x higher | 18kN·m/kg |
| Stiffness to weight | 12.9MN·m/kg8.34x higher | 1.55MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-M30 = CuZn30 = C26000, rolled products) | not sourced |
| Shear modulus | 41.2GPa | not sourced |
| Bulk modulus | 115GPa | not sourced |
| Speed of sound | 3,597m/s | 1,246m/s |
| Thermal | ||
| Thermal conductivity | 121W/m·Ksourcetypical, 20 °C | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| Thermal expansion | 20µm/m·Ksourcetypical, mean 20-300 °C | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| 100 mm part over a 50 °C swing | 100µm growth4x less | 400µm growth |
| Specific heat | 377J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 37.7mm²/s | not sourced |
| Thermal shock resistance | 12,510W/m | not sourced |
| Melting point | 916–954°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 99°Csourcetypical |
| Max service temperature | not sourced | 86°CsourceHDT 1.8 MPa |
| Values for | C26000 cartridge brass, H02 half hard flat/strip: CDA Electronic Connector Design Guide (mechanical) + CDA alloy page (physical) | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Brass C260 stronger than FDM HIPS?
Brass C260 is stronger: its yield strength is 345 MPa against tensile strength 18.4 MPa for FDM HIPS (18.8x).
Which is lighter, Brass C260 or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 8,525 kg/m³ for Brass C260.
Which is stiffer, Brass C260 or FDM HIPS?
Brass C260 is stiffer: Young's modulus 110 GPa against 1.59 GPa for FDM HIPS, so the same part in Brass C260 deflects less under the same load.
Which is lighter for the same job, Brass C260 or FDM HIPS?
For the same stiffness or strength: Brass C260 is lighter for a stiff rod or tie (tension), strong rod or tie; FDM HIPS is lighter for a stiff panel or plate, strong beam, strong panel or plate.
| Part that must be | Brass C260 | FDM HIPS |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 8.34x heavier |
| Stiff beam (bending) | about equal | about equal |
| Stiff panel or plate | 2.03x heavier | lighter |
| Strong rod or tie | lighter | 2.25x heavier |
| Strong beam | 18% heavier | lighter |
| Strong panel or plate | 1.92x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Brass C260 or FDM HIPS?
Brass C260 conducts heat better: 121 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Brass C260 expands less: 20 µm/m·K against 80 µm/m·K for FDM HIPS.