Materials / Compare
Brass C360 vs. FDM HIPS
Compare Brass C360 vs. FDM HIPS strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 310MPasourcetypical, 0.5% extension under load | not given (tensile used) |
| Ultimate tensile strength | 400MPasourcetypical21.7x stronger | 18.4MPasourcetypical |
| Flexural strength | not sourced | 31.8MPasourcetypical |
| Elongation at break | 25%sourcetypical, 1 in. rod | 1.4%sourcetypical |
| Young's modulus (stiffness) | 96.5GPasourcetypical, temper-independent | 1.59GPasourcetypical |
| Density | 8,498kg/m³sourcenominal | 1,023kg/m³sourcetypical |
| Strength to weight | 36.5kN·m/kg2.03x higher | 18kN·m/kg |
| Stiffness to weight | 11.4MN·m/kg7.32x higher | 1.55MN·m/kg |
| Poisson's ratio | 0.34sourcebase material: leaded free-machining brass CuZn39Pb2 (C37700), Wieland-Z30 rolled products, reference value at room temperature | not sourced |
| Shear modulus | 36GPa | not sourced |
| Bulk modulus | 101GPa | not sourced |
| Speed of sound | 3,370m/s | 1,246m/s |
| Thermal | ||
| Thermal conductivity | 116W/m·Ksourcetypical, 20 °C | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| Thermal expansion | 20.5µm/m·Ksourcetypical, mean 20-300 °C | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| 100 mm part over a 50 °C swing | 103µm growth3.9x less | 400µm growth |
| Specific heat | 377J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 36.2mm²/s | not sourced |
| Thermal shock resistance | 11,997W/m | not sourced |
| Melting point | 888–899°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 99°Csourcetypical |
| Max service temperature | not sourced | 86°CsourceHDT 1.8 MPa |
| Values for | C36000 free-cutting brass, H02 half-hard rod 1 in. section (20% cold work), copper.org typical values | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Brass C360 stronger than FDM HIPS?
Brass C360 is stronger: its yield strength is 310 MPa against tensile strength 18.4 MPa for FDM HIPS (16.8x).
Which is lighter, Brass C360 or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 8,498 kg/m³ for Brass C360.
Which is stiffer, Brass C360 or FDM HIPS?
Brass C360 is stiffer: Young's modulus 96.5 GPa against 1.59 GPa for FDM HIPS, so the same part in Brass C360 deflects less under the same load.
Which is lighter for the same job, Brass C360 or FDM HIPS?
For the same stiffness or strength: Brass C360 is lighter for a stiff rod or tie (tension), strong rod or tie; FDM HIPS is lighter for a stiff beam (bending), stiff panel or plate, strong beam, strong panel or plate.
| Part that must be | Brass C360 | FDM HIPS |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 7.32x heavier |
| Stiff beam (bending) | 7% heavier | lighter |
| Stiff panel or plate | 2.11x heavier | lighter |
| Strong rod or tie | lighter | 2.03x heavier |
| Strong beam | 26% heavier | lighter |
| Strong panel or plate | 2.02x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Brass C360 or FDM HIPS?
Brass C360 conducts heat better: 116 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Brass C360 expands less: 20.5 µm/m·K against 80 µm/m·K for FDM HIPS.