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Ceramic Alumina 96% vs. PCB Board FR-4, 2 copper planes
Compare Ceramic Alumina 96% vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.
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Ceramic Alumina 96%Sintered ceramic (pressed and fired)
PCB Board FR-4, 2 copper planesComposite
| Try it on a partA panel to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | not given (tensile used) |
| Ultimate tensile strength | 221MPasourcetypical tensile strength, 25 °C (ACMA Test #4) | 246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) |
| Compressive strength | 2,068MPasourcetypical, 20 °C (ASTM-C773) | not sourced |
| Flexural strength | 358MPasourceflexural strength (MOR), 20 °C (ASTM-F417) | not sourced |
| Elongation at break | not sourced | not sourced |
| Young's modulus (stiffness) | 303GPasourcetypical, 20 °C (ASTM-C848) | 21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out |
| Density | 3,720kg/m³sourcetypical (ASTM-C20) | not sourced |
| Strength to weight | 59.4kN·m/kg | not sourced |
| Stiffness to weight | 81.5MN·m/kg | not sourced |
| Poisson's ratio | 0.21sourcetypical, 20 °C (ASTM-C848) | 0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction |
| Shear modulus | 125GPa12.3x stiffer in shear | 10.2GPa |
| Bulk modulus | 174GPa | 12.2GPa |
| Speed of sound | 9,025m/s | not sourced |
| Thermal | ||
| Thermal conductivity | 24.7W/m·Ksourcetypical, 20 °C (ASTM-C408) | not sourced |
| Thermal expansion | 8.2µm/m·Ksourcemean, 25-1000 °C (ASTM-C372) | 13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 41µm growth1.65x less | 67.5µm growth |
| Specific heat | 880J/kg·Ksourcetypical, 100 °C (ASTM-E1269) | not sourced |
| Heats up and cools (diffusivity) | 7.55mm²/s | not sourced |
| Thermal shock resistance | 1,736W/m | not sourced |
| Values for | CoorsTek AD-96, nominal 96% Al2O3 sintered alumina, typical values; CoorsTek "Ceramic Seal Material Properties" (© 2018, 01899 F). AD-96 is the general 96% grade, not the ADS-96R substrate grade. | A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Ceramic Alumina 96% stronger than PCB Board FR-4, 2 copper planes?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against 221 MPa for Ceramic Alumina 96% (43%).
Which is stiffer, Ceramic Alumina 96% or PCB Board FR-4, 2 copper planes?
Ceramic Alumina 96% is stiffer: Young's modulus 303 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Ceramic Alumina 96% deflects less under the same load.
Which expands less with temperature?
Ceramic Alumina 96% expands less: 8.2 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.
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