SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Ceramic Alumina 96% stronger than Solder SAC305?
Ceramic Alumina 96% is stronger: its tensile strength is 221 MPa against yield strength 22 MPa for Solder SAC305 (10x).
Which is lighter, Ceramic Alumina 96% or Solder SAC305?
Ceramic Alumina 96% is lighter: 3,720 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, Ceramic Alumina 96% or Solder SAC305?
Ceramic Alumina 96% is stiffer: Young's modulus 303 GPa against 6.9 GPa for Solder SAC305, so the same part in Ceramic Alumina 96% deflects less under the same load.
Which is lighter for the same job, Ceramic Alumina 96% or Solder SAC305?
For the same stiffness or strength: Ceramic Alumina 96% is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Ceramic Alumina 96%
Solder SAC305
Stiff rod or tie (tension)
lighter
86.8x heavier
Stiff beam (bending)
lighter
13.1x heavier
Stiff panel or plate
lighter
6.97x heavier
Strong rod or tie
lighter
19.8x heavier
Strong beam
lighter
9.2x heavier
Strong panel or plate
lighter
6.26x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Ceramic Alumina 96% or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 24.7 W/m·K for Ceramic Alumina 96%.
Which expands less with temperature?
Ceramic Alumina 96% expands less: 8.2 µm/m·K against 21.9 µm/m·K for Solder SAC305.