Materials / Compare
Ceramic Aluminum Nitride vs. FDM Polycarbonate
Compare Ceramic Aluminum Nitride vs. FDM Polycarbonate strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not sourced | 53.3MPasourcetypical |
| Ultimate tensile strength | not sourced | 53.3MPasourcetypical, peak stress (= stress at yield) |
| Flexural strength | 310MPasource3-point bending strength (JIS R 1601) | 89.4MPasourcetypical |
| Elongation at break | not sourced | 9.2%sourcetypical |
| Young's modulus (stiffness) | 320GPasourcetypical (JIS R 1602) | 2.39GPasourcetypical |
| Density | 3,400kg/m³sourcetypical (JIS R 1634) | 1,180–1,200kg/m³sourcerange |
| Strength to weight | not sourced | 44.8kN·m/kg |
| Stiffness to weight | 94.1MN·m/kg46.8x higher | 2.01MN·m/kg |
| Poisson's ratio | 0.24sourcetypical (JIS R 1602) | 0.38sourcebase material: polycarbonate family typical (Covestro Part and Mold Design guide, Table 3-1) |
| Shear modulus | 129GPa149x stiffer in shear | 0.867GPa |
| Bulk modulus | 205GPa | 3.33GPa |
| Speed of sound | 9,701m/s | 1,418m/s |
| Thermal | ||
| Thermal conductivity | 150W/m·Ksourcetypical (JIS R 1611) | 0.2W/m·Ksourcebase material: Covestro Makrolon 2405 injection-molding PC, typical, through-plane, 23 °C |
| Thermal expansion | 4.6µm/m·Ksourcemean, 40-400 °C (JIS R 1618) | 65µm/m·Ksourcebase material: Covestro Makrolon 2405 injection-molding PC, typical, 23-55 °C, parallel |
| 100 mm part over a 50 °C swing | 23µm growth14.1x less | 325µm growth |
| Specific heat | 710J/kg·Ksourcetypical (JIS R 1611) | not sourced |
| Heats up and cools (diffusivity) | 62.1mm²/s | not sourced |
| Thermal shock resistance | not sourced | 42.5W/m |
| Glass transition | not sourced | 108°Csourcetypical |
| Max service temperature | not sourced | 105°CsourceHDT 0.455 MPa (printed specimens) |
| Values for | KYOCERA AN216A dense sintered aluminium nitride, typical values; KYOCERA Fineceramics Europe data sheet 2023.04.03 | Ultimaker PC, 3D-printed specimens, XY (flat); Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS (file v5.00), April 20, 2022. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM Polycarbonate is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Which is lighter, Ceramic Aluminum Nitride or FDM Polycarbonate?
FDM Polycarbonate is lighter: 1,190 kg/m³ against 3,400 kg/m³ for Ceramic Aluminum Nitride.
Which is stiffer, Ceramic Aluminum Nitride or FDM Polycarbonate?
Ceramic Aluminum Nitride is stiffer: Young's modulus 320 GPa against 2.39 GPa for FDM Polycarbonate, so the same part in Ceramic Aluminum Nitride deflects less under the same load.
Which is lighter for the same job, Ceramic Aluminum Nitride or FDM Polycarbonate?
For the same stiffness or strength: Ceramic Aluminum Nitride is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
| Part that must be | Ceramic Aluminum Nitride | FDM Polycarbonate |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 46.8x heavier |
| Stiff beam (bending) | lighter | 4.05x heavier |
| Stiff panel or plate | lighter | 1.79x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Ceramic Aluminum Nitride or FDM Polycarbonate?
Ceramic Aluminum Nitride conducts heat better: 150 W/m·K against 0.2 W/m·K for FDM Polycarbonate.
Which expands less with temperature?
Ceramic Aluminum Nitride expands less: 4.6 µm/m·K against 65 µm/m·K for FDM Polycarbonate.
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