KYOCERA AN216A dense sintered aluminium nitride, typical values; KYOCERA Fineceramics Europe data sheet 2023.04.03
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Which is lighter, Ceramic Aluminum Nitride or Solder SAC305?
Ceramic Aluminum Nitride is lighter: 3,400 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, Ceramic Aluminum Nitride or Solder SAC305?
Ceramic Aluminum Nitride is stiffer: Young's modulus 320 GPa against 6.9 GPa for Solder SAC305, so the same part in Ceramic Aluminum Nitride deflects less under the same load.
Which is lighter for the same job, Ceramic Aluminum Nitride or Solder SAC305?
For the same stiffness or strength: Ceramic Aluminum Nitride is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate.
Part that must be
Ceramic Aluminum Nitride
Solder SAC305
Stiff rod or tie (tension)
lighter
100x heavier
Stiff beam (bending)
lighter
14.7x heavier
Stiff panel or plate
lighter
7.77x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Ceramic Aluminum Nitride or Solder SAC305?
Ceramic Aluminum Nitride conducts heat better: 150 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
Ceramic Aluminum Nitride expands less: 4.6 µm/m·K against 21.9 µm/m·K for Solder SAC305.