Materials / Compare
Copper C10100 vs. FDM ASA Compare Copper C10100 vs. FDM ASA strength, stiffness, weight and thermal properties.
Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Rubber Wood Aluminum Aluminum 6061-T6 Aluminum 7075-T6 Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Steel Steel AISI 1018 Steel AISI 1045 Steel AISI 4340 Steel A992 Iron Titanium Titanium Ti-6Al-4V Stainless Steel 304 Stainless Steel 316 Stainless Steel 303 Stainless Steel 17-4PH Brass C360 Brass C260 Copper C110 Copper C10100 Copper C12200 Glass Nickel Inconel 718 Magnesium AZ31B-H24 Magnesium AZ91D Zinc Zamak 3 FDM ASA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLA Resin Elastic 50A SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick Plywood Drywall PCB Laminate FR-4 PCB Board FR-4, 2 copper planes Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Solder SAC305 Copper C10100 Wrought Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Rubber Wood Aluminum Aluminum 6061-T6 Aluminum 7075-T6 Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Steel Steel AISI 1018 Steel AISI 1045 Steel AISI 4340 Steel A992 Iron Titanium Titanium Ti-6Al-4V Stainless Steel 304 Stainless Steel 316 Stainless Steel 303 Stainless Steel 17-4PH Brass C360 Brass C260 Copper C110 Copper C10100 Copper C12200 Glass Nickel Inconel 718 Magnesium AZ31B-H24 Magnesium AZ91D Zinc Zamak 3 FDM ASA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLA Resin Elastic 50A SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick Plywood Drywall PCB Laminate FR-4 PCB Board FR-4, 2 copper planes Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Solder SAC305 FDM ASA 3D printed (FDM) Mechanical Copper C10100 FDM ASA Yield strength 69 MPa not given (tensile used) Ultimate tensile strength 221 MPa 5.97x stronger 37 MPa Flexural strength not sourced 65 MPa Elongation at break 45 % 4.89x more ductile 9.2 % Young's modulus (stiffness) 117 GPa 47.8x stiffer 2.45 GPa Density 8,941 kg/m³ 1,050 kg/m³ 8.52x lighter Strength to weight 7.72 kN·m/kg 35.2 kN·m/kg 4.57x higher Stiffness to weight 13.1 MN·m/kg 5.62x higher 2.33 MN·m/kg Poisson's ratio 0.34 not sourced Shear modulus 43.7 GPa not sourced Bulk modulus 122 GPa not sourced Speed of sound 3,621 m/s 2.37x faster 1,528 m/s
1k 10k 0.1 1 10 100 Density (kg/m³) Young's modulus (GPa) Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Copper C10100 FDM ASA Stiffness against densityHigher and further left: stiffer for its weight 1k 10k 10 100 1k Density (kg/m³) Yield strength (MPa) Plastic PLA Plastic PETG Plastic ABS Plastic TPU Plastic Nylon Rubber Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM Polycarbonate FDM PAHT-CF FDM HIPS SLA Resin Standard SLA Resin Tough 2000 SLA Resin Elastic 50A SLS PA12 Nylon DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Brick PCB Laminate FR-4 Silicon Ceramic Alumina 96% Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Copper C10100 FDM ASA Strength against densityHigher and further left: stronger for its weight
Thermal Copper C10100 FDM ASA Thermal conductivity 391 W/m·K 2,301x more heat through a fin base material 0.17 W/m·K Thermal expansion 16.9 µm/m·K base material 80–110 µm/m·K 100 mm part over a 50 °C swing 84.5 µm growth 5.62x less 475 µm growth Specific heat 385 J/kg·K not sourced Heats up and cools (diffusivity) 114 mm²/s not sourced Thermal shock resistance 8,992 W/m not sourced Melting point melting point 1,083 °C not sourced Max service temperature not sourced HDT 1.8 MPa 92 °C
1k 10k 0.1 1 10 100 Density (kg/m³) Thermal conductivity (W/m·K) Plastic PLA Plastic PETG Plastic ABS Plastic Nylon Rubber Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM Polycarbonate FDM HIPS SLA Resin Standard DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Copper C10100 FDM ASA Thermal conductivity against densityHigher and further left: spreads more heat for its weight 0.1 1 10 100 10 100 Thermal conductivity (W/m·K) Thermal expansion (µm/m·K) Plastic PETG Plastic ABS Plastic Nylon Wood Aluminum Steel Iron Titanium Steel AISI 1018 Stainless Steel 304 Stainless Steel 316 Aluminum 6061-T6 Aluminum 7075-T6 Brass C360 Copper C110 Copper C12200 Glass Steel AISI 1045 Steel AISI 4340 Steel A992 Stainless Steel 303 Stainless Steel 17-4PH Aluminum 2024-T351 Aluminum 5052-H32 Aluminum 7050-T7451 Titanium Ti-6Al-4V Brass C260 Nickel Inconel 718 Magnesium AZ31B-H24 Zinc Zamak 3 Plastic ABS (bulk/injection) Plastic Polycarbonate Plastic POM/Acetal Plastic Nylon PA6 Plastic Nylon PA66 Plastic PEEK Plastic PTFE Plastic UHMWPE Plastic HDPE Plastic Polypropylene Plastic PMMA FDM Polycarbonate FDM HIPS SLA Resin Standard DMLS AlSi10Mg Aluminum DMLS Ti-6Al-4V ELI Titanium DMLS 316L Stainless Steel DMLS 17-4PH Stainless Steel Concrete Brick Plywood PCB Laminate FR-4 Silicon Ceramic Alumina 96% Ceramic Aluminum Nitride Aluminum A380 Aluminum 6063-T6 Aluminum 1100-O Aluminum 3003-O Aluminum ADC12 Magnesium AZ91D Solder SAC305 Plastic PBT GF30 Plastic PPS GF40 Plastic LCP GF30 Copper C10100 FDM ASA Thermal expansion against thermal conductivityLower and further right: warps less when heated
Sources 4 documents: Copper Development Association, Bambu Lab, Wieland, INEOS Styrolution
Copper C10100 C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
FDM ASA Bambu Lab ASA, TDS V3.0, printed specimens X-Y; nozzle 260 °C, bed 80 °C, 200 mm/s, 100% infill; annealed and dried 80 °C for 12 h before testing. 1 C10100 Alloy (copper.org) Copper Development Association archived copy Copper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)2 Bambu ASA Technical Data Sheet, V3.0 Bambu Lab FDM ASA · Ultimate tensile strength: typicalFDM ASA · Flexural strength: typicalFDM ASA · Elongation at break: typicalFDM ASA · Young's modulus (stiffness): typicalFDM ASA · Density: typicalFDM ASA · Max service temperature: HDT 1.8 MPa
3 Wieland-K09 (Cu-OFE, C10100) Data Sheet Wieland Copper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
4 Luran S 777K (ASA) Product Data Sheet INEOS Styrolution FDM ASA · Thermal conductivity: base material: INEOS Styrolution Luran S 777K injection-molding ASA, typicalFDM ASA · Thermal expansion: base material: INEOS Styrolution Luran S 777K injection-molding ASA, range
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM ASA is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions Mechanical Is Copper C10100 stronger than FDM ASA? Copper C10100 is stronger: its yield strength is 69 MPa against tensile strength 37 MPa for FDM ASA (1.86x).
Which is lighter, Copper C10100 or FDM ASA? FDM ASA is lighter: 1,050 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or FDM ASA? Copper C10100 is stiffer: Young's modulus 117 GPa against 2.45 GPa for FDM ASA, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or FDM ASA? For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); FDM ASA is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be Copper C10100 FDM ASA Stiff rod or tie (tension) lighter 5.62x heavier Stiff beam (bending) 23% heavier lighter Stiff panel or plate 2.35x heavier lighter Strong rod or tie 4.57x heavier lighter Strong beam 5.62x heavier lighter Strong panel or plate 6.24x heavier lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or FDM ASA? Copper C10100 stretches further before it breaks: 45% elongation at break against 9.2% for FDM ASA.
Thermal Which conducts heat better, Copper C10100 or FDM ASA? Copper C10100 conducts heat better: 391 W/m·K against 0.17 W/m·K for FDM ASA.
Which expands less with temperature? Copper C10100 expands less: 16.9 µm/m·K against 95 µm/m·K for FDM ASA.