Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Copper Development Association, Isola, Park Electrochemical (Nelco), Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
PCB Laminate FR-4
Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Laminate FR-4 · Ultimate tensile strength: typical, in-plane: cross direction .. length direction (ASTM D3039)PCB Laminate FR-4 · Flexural strength: typical: cross direction .. length direction (IPC-TM-650 2.4.4B)PCB Laminate FR-4 · Young's modulus (stiffness): typical, in-plane: cross direction .. length direction (ASTM D790-15e2)PCB Laminate FR-4 · Poisson's ratio: typical, in-plane: cross direction .. length directionPCB Laminate FR-4 · Thermal conductivity: typical (ASTM E1952); direction not stated by the sheetPCB Laminate FR-4 · Thermal expansion: typical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)PCB Laminate FR-4 · Glass transition: typical, DSC (IPC-TM-650 2.4.25C)PCB Laminate FR-4 · Max service temperature: UL Relative Thermal Index (UL 796)
3
N4000-6 Laminate Data Sheet (2006)Park Electrochemical (Nelco)archived copyPCB Laminate FR-4 · Density: typical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HRPCB Laminate FR-4 · Specific heat: typical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR
4
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than PCB Laminate FR-4?
PCB Laminate FR-4 is stronger: its tensile strength is 315 MPa against yield strength 69 MPa for Copper C10100 (4.57x).
Which is lighter, Copper C10100 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or PCB Laminate FR-4?
Copper C10100 is stiffer: Young's modulus 117 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or PCB Laminate FR-4?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); PCB Laminate FR-4 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
PCB Laminate FR-4
Stiff rod or tie (tension)
lighter
5% heavier
Stiff beam (bending)
2.1x heavier
lighter
Stiff panel or plate
2.74x heavier
lighter
Strong rod or tie
21.3x heavier
lighter
Strong beam
12.8x heavier
lighter
Strong panel or plate
9.96x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or PCB Laminate FR-4?
Copper C10100 conducts heat better: 391 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 16.9 µm/m·K for Copper C10100.