Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Wood Handbook (FPL-GTR-282), Chapter 12: Mechanical Properties of Wood-Based Composite MaterialsUSDA Forest Products LaboratoryPlywood · Ultimate tensile strength: modulus of rupture (no direct tensile value)Plywood · Flexural strength: static bending MOR (Douglas-fir); range 33.72-42.61 across speciesPlywood · Young's modulus (stiffness): static bending MOE of the panel (Douglas-fir); range 6.96-8.55 across species
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
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Thermal Properties of Wood and Wood Panel Products for Use in Buildings (1988)USDA Forest Products Laboratoryarchived copyPlywood · Thermal conductivity: APA-recommended design value (Douglas-fir plywood), as reported by FPL/ORNL
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Wood Handbook (FPL-GTR-282), Chapter 4: Moisture Relations and Physical Properties of WoodUSDA Forest Products LaboratoryPlywood · Thermal expansion: base material: solid wood parallel to grain, ovendry, range across speciesPlywood · Specific heat: base material: solid wood (all species), 12% MC, 27 C
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Plywood?
Copper C10100 is stronger: its yield strength is 69 MPa against tensile strength 41.4 MPa for Plywood (1.67x).
Which is stiffer, Copper C10100 or Plywood?
Copper C10100 is stiffer: Young's modulus 117 GPa against 7.45 GPa for Plywood, so the same part in Copper C10100 deflects less under the same load.
Thermal
Which conducts heat better, Copper C10100 or Plywood?
Copper C10100 conducts heat better: 391 W/m·K against 0.12 W/m·K for Plywood.
Which expands less with temperature?
Plywood expands less: 3.8 µm/m·K against 16.9 µm/m·K for Copper C10100.