Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, Korth Kristalle, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Silicon
Synthetic single-crystal silicon (cubic, diamond structure), Korth Kristalle (crystal grower) material data; Korth usually supplies Floating Zone (FZ) material, Czochralski (Cz) also offered. Silicon is elastically anisotropic; the producer quotes one modulus and the solver is isotropic.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Si: SiliconKorth Kristallearchived copySilicon · Ultimate tensile strength: modulus of rupture (bending fracture stress); brittle, no yield pointSilicon · Flexural strength: modulus of ruptureSilicon · Young's modulus (stiffness): typical (single quoted value of an anisotropic crystal)Silicon · Density: typicalSilicon · Poisson's ratio: typicalSilicon · Thermal conductivity: typical at 313 K (40 °C)Silicon · Thermal expansion: typical at 300 KSilicon · Specific heat: typicalSilicon · Melting point: typicalSilicon · Max service temperature: producer's maximum application temperature (optical components)
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Silicon?
Silicon is stronger: its tensile strength is 130 MPa against yield strength 69 MPa for Copper C10100 (1.88x).
Which is lighter, Copper C10100 or Silicon?
Silicon is lighter: 2,329 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or Silicon?
Silicon is stiffer: Young's modulus 131 GPa against 117 GPa for Copper C10100, so the same part in Silicon deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Silicon?
For the same stiffness or strength: Silicon is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
Silicon
Stiff rod or tie (tension)
4.29x heavier
lighter
Stiff beam (bending)
4.06x heavier
lighter
Stiff panel or plate
3.98x heavier
lighter
Strong rod or tie
7.23x heavier
lighter
Strong beam
5.86x heavier
lighter
Strong panel or plate
5.27x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or Silicon?
Copper C10100 conducts heat better: 391 W/m·K against 163 W/m·K for Silicon.
Which expands less with temperature?
Silicon expands less: 2.62 µm/m·K against 16.9 µm/m·K for Copper C10100.