Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, Formlabs, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
SLA Resin Tough 2000
Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C10100 stronger than SLA Resin Tough 2000?
Copper C10100 is stronger: its yield strength is 69 MPa against 40.4 MPa for SLA Resin Tough 2000 (1.71x).
Which is lighter, Copper C10100 or SLA Resin Tough 2000?
SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or SLA Resin Tough 2000?
Copper C10100 is stiffer: Young's modulus 117 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or SLA Resin Tough 2000?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); SLA Resin Tough 2000 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
SLA Resin Tough 2000
Stiff rod or tie (tension)
lighter
7.94x heavier
Stiff beam (bending)
2% heavier
lighter
Stiff panel or plate
2.04x heavier
lighter
Strong rod or tie
4.8x heavier
lighter
Strong beam
5.74x heavier
lighter
Strong panel or plate
6.28x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or SLA Resin Tough 2000?
SLA Resin Tough 2000 stretches further before it breaks: 79% elongation at break against 45% for Copper C10100.
Thermal
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.