Materials / Compare
Copper C110 vs. FDM HIPS
Compare Copper C110 vs. FDM HIPS strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | not given (tensile used) |
| Ultimate tensile strength | 221MPasourcetypical12x stronger | 18.4MPasourcetypical |
| Flexural strength | not sourced | 31.8MPasourcetypical |
| Elongation at break | 55%sourcetypical, 1 in. rod | 1.4%sourcetypical |
| Young's modulus (stiffness) | 117GPasourcetypical73.8x stiffer | 1.59GPasourcetypical |
| Density | 8,913kg/m³sourcenominal | 1,023kg/m³sourcetypical |
| Strength to weight | 7.74kN·m/kg | 18kN·m/kg2.32x higher |
| Stiffness to weight | 13.1MN·m/kg8.47x higher | 1.55MN·m/kg |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | not sourced |
| Shear modulus | 43.7GPa | not sourced |
| Bulk modulus | 122GPa | not sourced |
| Speed of sound | 3,626m/s | 1,246m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| 100 mm part over a 50 °C swing | 84.5µm growth4.73x less | 400µm growth |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | not sourced |
| Heats up and cools (diffusivity) | 114mm²/s | not sourced |
| Thermal shock resistance | 8,992W/m | not sourced |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Glass transition | not sourced | 99°Csourcetypical |
| Max service temperature | not sourced | 86°CsourceHDT 1.8 MPa |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Copper C110 stronger than FDM HIPS?
Copper C110 is stronger: its yield strength is 69 MPa against tensile strength 18.4 MPa for FDM HIPS (3.75x).
Which is lighter, Copper C110 or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or FDM HIPS?
Copper C110 is stiffer: Young's modulus 117 GPa against 1.59 GPa for FDM HIPS, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or FDM HIPS?
For the same stiffness or strength: Copper C110 is lighter for a stiff rod or tie (tension); FDM HIPS is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | FDM HIPS |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 8.47x heavier |
| Stiff beam (bending) | 1% heavier | lighter |
| Stiff panel or plate | 2.08x heavier | lighter |
| Strong rod or tie | 2.32x heavier | lighter |
| Strong beam | 3.61x heavier | lighter |
| Strong panel or plate | 4.5x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or FDM HIPS?
Copper C110 conducts heat better: 391 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Copper C110 expands less: 16.9 µm/m·K against 80 µm/m·K for FDM HIPS.