Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources5 documents: Copper Development Association, Formlabs, Wieland
Copper C12200
C12200 phosphorus-deoxidized copper (DHP, the air-conditioning and refrigeration tube copper), tube annealed to 0.050 mm grain size (OS050), 0.065 in. wall, copper.org typical values
SLA Resin Standard
Formlabs Clear Resin V5 (FLGPCL05), TDS Rev. 01 March 20, 2024; printed on Form 4 at 100 µm, washed 5 min in >=99% IPA, post-cured 15 min at 60 °C in Form Cure. Orientation not stated.
1
C12200 Alloy (copper.org)Copper Development Associationarchived copyCopper C12200 · Yield strength: typical, 0.5% extension under load, 0.065 in. tubeCopper C12200 · Ultimate tensile strength: typical, 0.065 in. tubeCopper C12200 · Elongation at break: typical, 0.065 in. tubeCopper C12200 · Young's modulus (stiffness): typicalCopper C12200 · Density: nominalCopper C12200 · Thermal conductivity: typical, 20 °CCopper C12200 · Thermal expansion: typical, mean 20-100 °CCopper C12200 · Specific heat: typical, 20 °CCopper C12200 · Melting point: liquidus
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Clear Resin V5 Technical Data Sheet (2024)Formlabsarchived copySLA Resin Standard · Ultimate tensile strength: typicalSLA Resin Standard · Flexural strength: typicalSLA Resin Standard · Elongation at break: typicalSLA Resin Standard · Young's modulus (stiffness): typicalSLA Resin Standard · Max service temperature: HDT 1.8 MPa
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Clear Resin V5 Technical Data Sheet (web edition)FormlabsSLA Resin Standard · Density: typical, post-cured (same for 5 min ambient and 15 min at 60 °C), ASTM D792
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Wieland-K19 (Cu-DHP, C12200) Data SheetWielandarchived copyCopper C12200 · Poisson's ratio: reference value at room temperature (Wieland-K19 = Cu-DHP = C12200, rolled products)
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Thermal Properties of Selected Formlabs SLA ResinsFormlabsSLA Resin Standard · Thermal conductivity: typical, post-cured, ASTM E1530SLA Resin Standard · Thermal expansion: mean -30 to 140 °C, post-cured (5 min ambient cure), TMA ASTM E831SLA Resin Standard · Specific heat: typical, 25 °C, post-cured (5 min ambient cure), DSC ASTM E1269
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Standard is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C12200 stronger than SLA Resin Standard?
Copper C12200 is stronger: its yield strength is 69 MPa against tensile strength 60 MPa for SLA Resin Standard (15%).
Which is lighter, Copper C12200 or SLA Resin Standard?
SLA Resin Standard is lighter: 1,210 kg/m³ against 8,941 kg/m³ for Copper C12200.
Which is stiffer, Copper C12200 or SLA Resin Standard?
Copper C12200 is stiffer: Young's modulus 117 GPa against 2.75 GPa for SLA Resin Standard, so the same part in Copper C12200 deflects less under the same load.
Which is lighter for the same job, Copper C12200 or SLA Resin Standard?
For the same stiffness or strength: Copper C12200 is lighter for a stiff rod or tie (tension); SLA Resin Standard is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C12200
SLA Resin Standard
Stiff rod or tie (tension)
lighter
5.77x heavier
Stiff beam (bending)
13% heavier
lighter
Stiff panel or plate
2.12x heavier
lighter
Strong rod or tie
6.43x heavier
lighter
Strong beam
6.73x heavier
lighter
Strong panel or plate
6.89x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C12200 or SLA Resin Standard?
Copper C12200 stretches further before it breaks: 45% elongation at break against 8% for SLA Resin Standard.
Thermal
Which conducts heat better, Copper C12200 or SLA Resin Standard?
Copper C12200 conducts heat better: 339 W/m·K against 0.54 W/m·K for SLA Resin Standard.
Which expands less with temperature?
Copper C12200 expands less: 16.9 µm/m·K against 114 µm/m·K for SLA Resin Standard.