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DMLS Ti-6Al-4V ELI Titanium vs. PCB Board FR-4, 2 copper planes

Compare DMLS Ti-6Al-4V ELI Titanium vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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DMLS Ti-6Al-4V ELI Titanium3D printed metal (DMLS)
PCB Board FR-4, 2 copper planesComposite
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Mechanical
Yield strength1,100MPasourcetypical, as built, average of horizontal + vertical (M400)not given (tensile used)
Ultimate tensile strength1,270MPasourcetypical, as built, average of horizontal + vertical (M400)246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Elongation at break8.7%sourcetypical at break, as built (M400)not sourced
Young's modulus (stiffness)110GPasourcesame maker and process, sibling grade: EOS Titanium Ti64 (Grade 5) on EOS M 290, as built, XY and Z, typical21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density4,400kg/m³sourcetypical part density (ISO 3369), M400not sourced
Strength to weight250kN·m/kgnot sourced
Stiffness to weight25MN·m/kgnot sourced
Poisson's ratio0.342sourcewrought TIMETAL 6-4 (TIMET measurement, mean of 10); composition-level, not DMLS-measured0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulus41GPa4.03x stiffer in shear10.2GPa
Bulk modulus116GPa12.2GPa
Speed of sound5,000m/snot sourced
Thermal
Thermal conductivity6.6W/m·Ksourcebase material: wrought Ti-6Al-4V / 6-4 ELI (TIMET datasheet), 20 °Cnot sourced
Thermal expansion9µm/m·Ksourcemean 25-100 °C, ASTM E228; EOS Ti64 Grade 23 (=ELI) on EOS M 290 40 µm; condition not stated (sheet's mechanical data are heat treated)13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing45µm growth1.5x less67.5µm growth
Specific heat580J/kg·Ksourcebase material: wrought Ti-6Al-4V / 6-4 ELI (TIMET datasheet), 20 °Cnot sourced
Heats up and cools (diffusivity)2.59mm²/snot sourced
Thermal shock resistance4,825W/mnot sourced
Melting point1,630–1,650°Csourcemelting range, wrought TIMETAL 6-4 (composition-level)not sourced
Values forEOS Titanium Ti64ELI (powder 9011-0040; ASTM F136/F3001, i.e. Grade 23) on EOS M400 SF, parameter set Ti64ELI_030_FlexM400_100, 30 µm, as built; ISO 6892-1 A14A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

DMLS Ti-6Al-4V ELI Titanium is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Is DMLS Ti-6Al-4V ELI Titanium stronger than PCB Board FR-4, 2 copper planes?

DMLS Ti-6Al-4V ELI Titanium is stronger: its yield strength is 1,100 MPa against tensile strength 315 MPa for PCB Board FR-4, 2 copper planes (3.49x).

Which is stiffer, DMLS Ti-6Al-4V ELI Titanium or PCB Board FR-4, 2 copper planes?

DMLS Ti-6Al-4V ELI Titanium is stiffer: Young's modulus 110 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in DMLS Ti-6Al-4V ELI Titanium deflects less under the same load.

Which expands less with temperature?

DMLS Ti-6Al-4V ELI Titanium expands less: 9 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.

Among 73 materials

1k10k0.1110100Density (kg/m³)Young's modulus (GPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin Tough 2000SLS PA12 NylonDMLS AlSi10Mg AluminumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelPCB Laminate FR-4SiliconCeramic Alumina 96%Ceramic Aluminum NitrideAluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS Ti-6Al-4V ELI Titanium
Stiffness against density
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelBrickPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30DMLS Ti-6Al-4V ELI Titanium
Strength against density

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