300°Csourceproducer's maximum application temperature (optical components)
Values for
BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
Synthetic single-crystal silicon (cubic, diamond structure), Korth Kristalle (crystal grower) material data; Korth usually supplies Floating Zone (FZ) material, Czochralski (Cz) also offered. Silicon is elastically anisotropic; the producer quotes one modulus and the solver is isotropic.
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Silicon?
Silicon is stronger: its tensile strength is 130 MPa against 18.4 MPa for FDM HIPS (7.07x).
Which is lighter, FDM HIPS or Silicon?
FDM HIPS is lighter: 1,023 kg/m³ against 2,329 kg/m³ for Silicon.
Which is stiffer, FDM HIPS or Silicon?
Silicon is stiffer: Young's modulus 131 GPa against 1.59 GPa for FDM HIPS, so the same part in Silicon deflects less under the same load.
Which is lighter for the same job, FDM HIPS or Silicon?
For the same stiffness or strength: Silicon is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
FDM HIPS
Silicon
Stiff rod or tie (tension)
36.2x heavier
lighter
Stiff beam (bending)
3.99x heavier
lighter
Stiff panel or plate
1.91x heavier
lighter
Strong rod or tie
3.1x heavier
lighter
Strong beam
1.62x heavier
lighter
Strong panel or plate
17% heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, FDM HIPS or Silicon?
Silicon conducts heat better: 163 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Silicon expands less: 2.62 µm/m·K against 80 µm/m·K for FDM HIPS.