511°Csourcestrain point (ASTM C336) - stress-relaxation onset, not a rated service limit
not sourced
Values for
Annealed soda-lime-silica float glass, Pilkington North America Technical Bulletin ATS-129 (04/2025)
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Glass stronger than Solder SAC305?
Glass is stronger: its tensile strength is 41 MPa against yield strength 22 MPa for Solder SAC305 (1.86x).
Which is lighter, Glass or Solder SAC305?
Glass is lighter: 2,500 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, Glass or Solder SAC305?
Glass is stiffer: Young's modulus 72 GPa against 6.9 GPa for Solder SAC305, so the same part in Glass deflects less under the same load.
Which is lighter for the same job, Glass or Solder SAC305?
For the same stiffness or strength: Glass is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Glass
Solder SAC305
Stiff rod or tie (tension)
lighter
30.7x heavier
Stiff beam (bending)
lighter
9.5x heavier
Stiff panel or plate
lighter
6.42x heavier
Strong rod or tie
lighter
5.48x heavier
Strong beam
lighter
4.45x heavier
Strong panel or plate
lighter
4.01x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Glass or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.937 W/m·K for Glass.
Which expands less with temperature?
Glass expands less: 8.3 µm/m·K against 21.9 µm/m·K for Solder SAC305.