Materials / Compare
FDM HIPS vs. Plastic PEEK
Compare FDM HIPS vs. Plastic PEEK strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 98MPasourcetypical, tensile yield |
| Ultimate tensile strength | 18.4MPasourcetypical | not sourced |
| Compressive strength | not sourced | 125MPasourcetypical, 23 C |
| Flexural strength | 31.8MPasourcetypical | 165MPasourcetypical, flexural stress at yield, 23 C |
| Elongation at break | 1.4%sourcetypical | 25%sourcetypical, at break |
| Young's modulus (stiffness) | 1.59GPasourcetypical | 4GPasourcetypical (nominal) |
| Density | 1,023kg/m³sourcetypical | 1,300kg/m³sourcetypical (crystalline) |
| Strength to weight | 18kN·m/kg | 75.4kN·m/kg4.19x higher |
| Stiffness to weight | 1.55MN·m/kg | 3.08MN·m/kg1.98x higher |
| Poisson's ratio | not sourced | 0.38sourcetypical |
| Shear modulus | not sourced | 1.45GPa |
| Bulk modulus | not sourced | 5.56GPa |
| Speed of sound | 1,246m/s | 1,754m/s |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 0.29W/m·Ksourcetypical, average, 23 C |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 55µm/m·Ksourceaverage of flow/cross-flow, below Tg (<143 C) |
| 100 mm part over a 50 °C swing | 400µm growth | 275µm growth45% less |
| Specific heat | not sourced | 2,200J/kg·Ksourcetypical, 23 °C, DSC (Victrex PEEK 450G TDS, revision Jul 2012) |
| Heats up and cools (diffusivity) | not sourced | 0.101mm²/s |
| Thermal shock resistance | not sourced | 80.1W/m |
| Melting point | not sourced | 343°Csourcetypical, DSC |
| Glass transition | 99°Csourcetypical | 143°Csourceonset (midpoint 150 C) |
| Max service temperature | 86°CsourceHDT 1.8 MPa | 240°CsourceUL 746B RTI, mechanical strength (continuous use index) |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | Victrex PEEK 450G (unreinforced, injection moulded), Victrex TDS rev. March 2026; Poisson from Victrex fluid-management flyer (2020-07) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Plastic PEEK?
Plastic PEEK is stronger: its yield strength is 98 MPa against tensile strength 18.4 MPa for FDM HIPS (5.33x).
Which is lighter, FDM HIPS or Plastic PEEK?
FDM HIPS is lighter: 1,023 kg/m³ against 1,300 kg/m³ for Plastic PEEK.
Which is stiffer, FDM HIPS or Plastic PEEK?
Plastic PEEK is stiffer: Young's modulus 4 GPa against 1.59 GPa for FDM HIPS, so the same part in Plastic PEEK deflects less under the same load.
Which is lighter for the same job, FDM HIPS or Plastic PEEK?
For the same stiffness or strength: Plastic PEEK is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | FDM HIPS | Plastic PEEK |
|---|---|---|
| Stiff rod or tie (tension) | 1.98x heavier | lighter |
| Stiff beam (bending) | 25% heavier | lighter |
| Stiff panel or plate | 7% heavier | lighter |
| Strong rod or tie | 4.19x heavier | lighter |
| Strong beam | 2.4x heavier | lighter |
| Strong panel or plate | 1.82x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, FDM HIPS or Plastic PEEK?
Plastic PEEK conducts heat better: 0.29 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Plastic PEEK expands less: 55 µm/m·K against 80 µm/m·K for FDM HIPS.