Materials / Compare
FDM HIPS vs. Plastic PTFE
Compare FDM HIPS vs. Plastic PTFE strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 9MPasourcetypical yield strength at 23 °C (Teflon PTFE, Table 8) |
| Ultimate tensile strength | 18.4MPasourcetypical | 39.3MPasourcetypical, skived tape 0.13 mm |
| Flexural strength | 31.8MPasourcetypical | not sourced |
| Elongation at break | 1.4%sourcetypical | 350%sourcetypical, skived tape 0.13 mm |
| Young's modulus (stiffness) | 1.59GPasourcetypical | not sourced |
| Density | 1,023kg/m³sourcetypical | 2,160kg/m³sourcetypical (standard specific gravity, ASTM D4894) |
| Strength to weight | 18kN·m/kg4.32x higher | 4.17kN·m/kg |
| Stiffness to weight | 1.55MN·m/kg | not sourced |
| Poisson's ratio | not sourced | 0.46sourcetypical, 23 °C (Teflon PTFE resins, Chemours handbook) |
| Shear modulus | not sourced | not sourced |
| Bulk modulus | not sourced | not sourced |
| Speed of sound | 1,246m/s | not sourced |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 0.25W/m·Ksourcetypical, granular resin, 4.6 mm specimen |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 100µm/m·Ksourcetypical, granular resin, 23-60 °C (ASTM E228) |
| 100 mm part over a 50 °C swing | 400µm growth25% less | 500µm growth |
| Specific heat | not sourced | 1,400J/kg·Ksourcetypical, granular resin, 20 °C (ASTM D4591) |
| Heats up and cools (diffusivity) | not sourced | 0.0827mm²/s |
| Thermal shock resistance | not sourced | not sourced |
| Melting point | not sourced | 327°Csourcesecond melting peak (sintered polymer), +/-10 |
| Glass transition | 99°Csourcetypical | not sourced |
| Max service temperature | 86°CsourceHDT 1.8 MPa | 260°Csourceservice temperature (Chemours general Teflon PTFE statement) |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | Chemours Teflon PTFE 7C X granular molding resin, typical values (tensile/elongation measured on 0.13 mm skived tape) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Plastic PTFE?
FDM HIPS is stronger: its tensile strength is 18.4 MPa against yield strength 9 MPa for Plastic PTFE (2.04x).
Which is lighter, FDM HIPS or Plastic PTFE?
FDM HIPS is lighter: 1,023 kg/m³ against 2,160 kg/m³ for Plastic PTFE.
Which is lighter for the same job, FDM HIPS or Plastic PTFE?
For the same stiffness or strength: FDM HIPS is lighter for a strong rod or tie, strong beam, strong panel or plate.
| Part that must be | FDM HIPS | Plastic PTFE |
|---|---|---|
| Strong rod or tie | lighter | 4.32x heavier |
| Strong beam | lighter | 3.4x heavier |
| Strong panel or plate | lighter | 3.02x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, FDM HIPS or Plastic PTFE?
Plastic PTFE conducts heat better: 0.25 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
FDM HIPS expands less: 80 µm/m·K against 100 µm/m·K for Plastic PTFE.