Materials / Compare
FDM HIPS vs. SLA Resin Tough 2000
Compare FDM HIPS vs. SLA Resin Tough 2000 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 40.4MPasourcetypical |
| Ultimate tensile strength | 18.4MPasourcetypical | 40.4MPasourcetypical2.2x stronger |
| Flexural strength | 31.8MPasourcetypical | 67MPasourcetypical2.11x stronger in bending |
| Elongation at break | 1.4%sourcetypical | 79%sourcetypical56.4x more ductile |
| Young's modulus (stiffness) | 1.59GPasourcetypical | 1.8GPasourcetypical13% stiffer |
| Density | 1,023kg/m³sourcetypical | 1,090kg/m³sourcetypical |
| Strength to weight | 18kN·m/kg | 37.1kN·m/kg2.06x higher |
| Stiffness to weight | 1.55MN·m/kg | 1.65MN·m/kg6% higher |
| Poisson's ratio | not sourced | not sourced |
| Shear modulus | not sourced | not sourced |
| Bulk modulus | not sourced | not sourced |
| Speed of sound | 1,246m/s | 1,285m/s |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | not sourced |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 134µm/m·Ksourcemean 0-150 °C |
| 100 mm part over a 50 °C swing | 400µm growth1.68x less | 671µm growth |
| Specific heat | not sourced | not sourced |
| Heats up and cools (diffusivity) | not sourced | not sourced |
| Thermal shock resistance | not sourced | not sourced |
| Glass transition | 99°Csourcetypical | 112°CsourceDMA |
| Max service temperature | 86°CsourceHDT 1.8 MPa1.51x hotter | 57°CsourceHDT 1.8 MPa |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS and SLA Resin Tough 2000 are 3D printed: their properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than SLA Resin Tough 2000?
SLA Resin Tough 2000 is stronger: its yield strength is 40.4 MPa against tensile strength 18.4 MPa for FDM HIPS (2.2x).
Which is lighter, FDM HIPS or SLA Resin Tough 2000?
FDM HIPS is lighter: 1,023 kg/m³ against 1,090 kg/m³ for SLA Resin Tough 2000.
Which is stiffer, FDM HIPS or SLA Resin Tough 2000?
SLA Resin Tough 2000 is stiffer: Young's modulus 1.8 GPa against 1.59 GPa for FDM HIPS, so the same part in SLA Resin Tough 2000 deflects less under the same load.
Which is lighter for the same job, FDM HIPS or SLA Resin Tough 2000?
For the same stiffness or strength: FDM HIPS is lighter for a stiff panel or plate; SLA Resin Tough 2000 is lighter for a stiff rod or tie (tension), strong rod or tie, strong beam, strong panel or plate.
| Part that must be | FDM HIPS | SLA Resin Tough 2000 |
|---|---|---|
| Stiff rod or tie (tension) | 6% heavier | lighter |
| Stiff beam (bending) | about equal | about equal |
| Stiff panel or plate | lighter | 2% heavier |
| Strong rod or tie | 2.06x heavier | lighter |
| Strong beam | 1.59x heavier | lighter |
| Strong panel or plate | 39% heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, FDM HIPS or SLA Resin Tough 2000?
SLA Resin Tough 2000 stretches further before it breaks: 79% elongation at break against 1.4% for FDM HIPS.
Which handles higher temperatures, FDM HIPS or SLA Resin Tough 2000?
FDM HIPS does: 86 °C against 57 °C for SLA Resin Tough 2000, both HDT 1.8 MPa.
Which expands less with temperature?
FDM HIPS expands less: 80 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.