Cleveland-Cliffs / AK Steel ARMCO Pure Iron Product Data Bulletin (07/2022): Table 1 typical physical properties, Table 2 typical mechanical properties after SRA/recrystallization anneal.
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Iron stronger than Solder SAC305?
Iron is stronger: its yield strength is 186 MPa against 22 MPa for Solder SAC305 (8.45x).
Which is lighter, Iron or Solder SAC305?
Solder SAC305 is lighter: 7,350 kg/m³ against 7,860 kg/m³ for Iron.
Which is stiffer, Iron or Solder SAC305?
Iron is stiffer: Young's modulus 207 GPa against 6.9 GPa for Solder SAC305, so the same part in Iron deflects less under the same load.
Which is lighter for the same job, Iron or Solder SAC305?
For the same stiffness or strength: Iron is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Iron
Solder SAC305
Stiff rod or tie (tension)
lighter
28.1x heavier
Stiff beam (bending)
lighter
5.12x heavier
Stiff panel or plate
lighter
2.91x heavier
Strong rod or tie
lighter
7.91x heavier
Strong beam
lighter
3.88x heavier
Strong panel or plate
lighter
2.72x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Iron or Solder SAC305?
Iron conducts heat better: 73.2 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
Iron expands less: 13.7 µm/m·K against 21.9 µm/m·K for Solder SAC305.