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PCB Board FR-4, 2 copper planes vs. Plastic LCP GF30
Compare PCB Board FR-4, 2 copper planes vs. Plastic LCP GF30 strength, stiffness, weight and thermal properties.
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PCB Board FR-4, 2 copper planesComposite
Plastic LCP GF30Bulk polymer (molded or machined)
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | not given (tensile used) |
| Ultimate tensile strength | 246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) | 115MPasourcetensile strength (ISO 527) |
| Flexural strength | not sourced | 184MPasourcetypical (ISO 178) |
| Elongation at break | not sourced | 1.5%sourcetensile elongation (ISO 527) |
| Young's modulus (stiffness) | 21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out | 11.5GPasourcetensile modulus (ISO 527) |
| Density | not sourced | 1,610kg/m³sourcetypical |
| Strength to weight | not sourced | 71.4kN·m/kg |
| Stiffness to weight | not sourced | 7.14MN·m/kg |
| Poisson's ratio | 0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction | not sourced |
| Shear modulus | 10.2GPa | not sourced |
| Bulk modulus | 12.2GPa | not sourced |
| Speed of sound | not sourced | 2,673m/s |
| Thermal | ||
| Thermal conductivity | not sourced | 0.5W/m·Ksourcehot disk (ISO 22007-2), temperature not stated |
| Thermal expansion | 13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) | 20µm/m·Ksourceflow direction (MD), mean 50-150 °C |
| 100 mm part over a 50 °C swing | 67.5µm growth48% less | 100µm growth |
| Specific heat | not sourced | 839J/kg·KsourceASTM E1269, temperature not stated |
| Heats up and cools (diffusivity) | not sourced | 0.37mm²/s |
| Thermal shock resistance | not sourced | not sourced |
| Max service temperature | not sourced | 288°CsourceHDT 1.8 MPa (ISO 75) |
| Values for | A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. | Sumitomo Chemical SUMIKASUPER LCP E6006L (30% glass fibre; high strength, low shrinkage); SUMIKASUPER LCP Technical Note, Version 04 / Nov. 2023, typical values. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is PCB Board FR-4, 2 copper planes stronger than Plastic LCP GF30?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against 115 MPa for Plastic LCP GF30 (2.74x).
Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic LCP GF30?
PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 11.5 GPa for Plastic LCP GF30, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 20 µm/m·K for Plastic LCP GF30.
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